Senior Engineer

Infineon Technologies; Malacca City; On-site; MYR 120,000 - 180,000; Full time

Job summary

Infineon Technologies in Malaysia seeks a Senior Engineer to lead process development and singulation technology for high-volume semiconductor backend assembly. You will drive Tape-based, Tapeless and Laser singulation projects, coordinate with Operations, and shape process roadmaps to meet quality and cost targets.

The role requires hands-on expertise, strong analytical skills, and leadership to mentor fellow engineers while advancing new tech initiatives across development projects.

Qualifications

• Masters or Bachelors in Engineering or related field with 10+ years in semiconductor backend assembly.
• Minimum 5+ years direct experience in package singulation process development.
• Hands-on expertise in Tape-based, Tapeless and Laser singulation.
• Experience in high-volume semiconductor manufacturing environments.
• Proven track record in process development, industrialization and yield improvement.

Responsibilities

• Perform process development activities to meet timeline, quality and cost targets.
• Drive qualification and implementation of singulation technologies and solutions.
• Provide technical handshake and knowledge transfer to Operations.
• Generate and update Process Specifications, FMEA, OJTI and related documents.
• Support prototype and development samples build.
• Evaluate emerging singulation technologies for readiness.
• Update Process Roadmaps, Failure catalogs and Control Plans.
• Collaborate with suppliers for tooling, machines and materials verification.
• Identify new process technology and improve capability for business needs.
• Benchmark industry best practices and drive competitive advantage.
• Provide technical guidance to engineers and project teams.

Skills

Technical leadership

Analytical skills

Stakeholder management

Strategic thinking

Education

Masters/Bachelor's Degree in Engineering

Tools

Tape-based singulation

Tapeless singulation

Laser singulation

Blade dicing

Saw singulation

Job description

#WeAreIn for jobs that impact everyone's life. Join the thinkers, builders, and problem-solvers behind tomorrow’s technology. As a Senior Engineer, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in?

Your role

Key responsibilities in your new role

• Perform Process development activities (Process parameters scouting, optimization, verification and Process Freeze) in Development projects to meet the project targets in term of timeline, quality, cost competitiveness and manufacturability
• Drive qualification and implement for Tape-based singulation processes, Tapeless singulation solutions, Laser singulation technologies, and Hybrid singulation approaches
• Responsible or support for technical handshake and knowledge transfer to Operations
• Generate and update relevant documents, (e.g. Process Specification, PFMEA, DFMEA, Master FMEA, OJTI, T32, PDR)
• Support prototype and development samples build
• Evaluate emerging singulation technologies and establish technology readiness for industrial deployment
• Provide inputs for updating of related documents and is responsible for their correct contents, (e.g. Process of Record, Assembly Design Rule, Process Roadmap, Failure catalogue, Control Plan, Maintenance checklist, Unit process roadmap for development projects)
• Liaise with suppliers for continuous improvement and perform verification and qualification activities for new tooling, machines and materials in Development projects
• Identify and develop new Process technology and improve Process capability to meet new requirements from Business divisions
• Benchmark industry best practices and identify opportunities for competitive advantage
• Provide technical guidance/buddy to other engineers and project team

Your profile

Qualifications And Skills To Help You Succeed

• Masters/Bachelor's Degree in Engineering or relevant course with a minimum 10+ years experience in semiconductor backend assembly and package development
• Minimum 5+ years direct experience in package singulation process development
• Proven hands‑on expertise in Tape‑based singulation, Tapeless singulation, and Laser singulation
• Experience supporting high-volume semiconductor manufacturing environments
• Demonstrated track record in process development, industrialization, and yield improvement.
• Experience with technical competencies for different singulation technologies: Blade dicing and saw singulation, Tape‑based package singulation, Tapeless package handling and singulation, UV and IR laser singulation processes, Stealth and advanced laser dicing technologies, as well as Multi‑package and panel‑level singulation strategies
• Experience working with major singulation equipment suppliers and laser technology providers is an added advantage
• Strong technical leadership and influence without direct authority
• Good in strategic thinking and technology roadmap planning
• Excellent problem‑solving and analytical skills
• Strong stakeholder management and communication capabilities

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game‑changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.