Senior Die Attach Process Engineer – R&D to Ramp-Up Impact

Ams Osram

Bayan Lepas

On-site

MYR 50,000 - 70,000

Full time

14 days+

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Job summary

Ams Osram in Bayan Lepas, Penang is looking for a skilled engineer to develop and optimize FOL/EOL processes, especially the Die Attach process for new product development projects. The ideal candidate will have a degree in Electrical, Electronics, Mechatronics, or Mechanical Engineering, along with 2-3 years of experience in the semiconductor field.

The role includes responsibilities such as equipment selection, providing technical guidance to junior staff, and participating in engineering sample builds to fulfill customer orders. Join Ams Osram and become a part of a team that values innovation and high performance.

Qualifications

  • 2-3 years in semiconductor field especially in Die Attach.
  • Strong understanding of FOL/EOL processes.

Responsibilities

  • Develop and optimize FOL/EOL processes for new product development.
  • Equipment selection for project cost and quality targets.
  • Provide technical guidance to junior staff.

Skills

Process engineering knowledge in semiconductors or LED manufacturing processes
Knowledge in process development step and statistic
B. Minitab knowledge
Six Sigma Green or Black Belt

Education

Degree or Master in Electrical / Electronics / Mechatronics / Mechanical Engineering or equivalent

Job description

Ams Osram in Bayan Lepas, Penang is looking for a skilled engineer to develop and optimize FOL/EOL processes, especially the Die Attach process for new product development projects. The ideal candidate will have a degree in Electrical, Electronics, Mechatronics, or Mechanical Engineering, along with 2-3 years of experience in the semiconductor field.

The role includes responsibilities such as equipment selection, providing technical guidance to junior staff, and participating in engineering sample builds to fulfill customer orders. Join Ams Osram and become a part of a team that values innovation and high performance.

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