Die-Layer Attach Process Engineer - NPI & Innovation Leader

OSRAM Opto Semiconductors (Malaysia) Sdn. Bhd., Penang

Bayan Lepas

On-site

MYR 90,000 - 150,000

Full time

3 days ago

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Job summary

ams OSRAM Opto Semiconductors Malaysia is seeking a Die-Layer Attach Process Development Staff Engineer to lead process development for die attach and layer attach, integrating NPI with cost and yield targets. You will work on cross-functional teams to streamline manufacturing and drive continuous improvement across design rules, process know-how and supplier technologies.

The role requires a Bachelor's in Engineering and 2+ years in semiconductor Die Attach/Layer Attach, with hands-on

Qualifications

Bachelor's Degree in Engineering or equivalent.
2+ years in semiconductor Die Attach/Layer Attach process engineering.
Die Attach/Layer Attach process knowledge in semiconductors or LED manufacturing.
Experience with Process development or New Product Introduction is advantageous.
Hands-on process development experience in FOL related processes (sawing, die attach, wire bond).
Strong analytical and problem-solving skills; Six Sigma knowledge preferred.
Proficiency with Microsoft Excel, Word, PowerPoint; JMP knowledge required.

Responsibilities

Support NPI and deliver process solutions meeting quality, cost, and timeline targets.
Drive equipment dual sourcing and cost optimization for sourcing resilience.
Lead or contribute to solving recurring manufacturing and process challenges.
Provide technical leadership in cross-functional problem solving and yield improvement.
Maintain and enhance technical competency through design guidelines, process know-how, and supplier technologies.
Participate in internal/external knowledge-sharing activities and forums.