Semiconductor NPI & Mass Production Liaison Engineer

Chipbond Technology Malaysia; Penang; On-site; MYR 39,000 - 61,000; Full time

Job summary

Chipbond Technology Malaysia is seeking a Product Engineering professional to lead the integration of new semiconductor products from customer design through pilot and mass production. You will act as the main technical interface for customers and internal teams.

The role requires a Bachelor's in engineering, at least 1 year in product engineering, and fluency in Mandarin and English to coordinate with Taiwan headquarters and Mandarin-speaking clients. Fresh graduates are encouraged to apply.

Qualifications

• Bachelor's degree in an engineering field with at least 1 year in semiconductor product engineering.
• Fresh graduates are welcome to apply.
• Proficiency in Mandarin and English required for coordination with Taiwan HQ and Mandarin-speaking clients.

Responsibilities

• Own the integration of new products from design to pilot and mass production.
• Coordinate with frontend, backend, and testing teams and customers.
• Plan roadmaps, milestones, and risk management.
• Monitor mass production yield, cycle time, OEE, and quality trends; drive improvements.
• Support audits, line reviews, and qualification reviews.

Skills

Mandarin

English

Cross-functional

Product engineering

Education

Bachelor's degree in engineering

Job description

Chipbond Technology Malaysia is seeking a Product Engineering professional to lead the integration of new semiconductor products from customer design through pilot and mass production. You will act as the main technical interface for customers and internal teams.

The role requires a Bachelor's in engineering, at least 1 year in product engineering, and fluency in Mandarin and English to coordinate with Taiwan headquarters and Mandarin-speaking clients. Fresh graduates are encouraged to apply.