An application made for this job — a tailored resume and cover letter that speak straight to the posting.
Resonac Materials Malaysia Sdn. Bhd. invites applications for a Research and Development Engineer to engage with customers, refine epoxy encapsulation molding compounds, and support new product launches. You will contribute to trials, product optimization, and cross-functional collaboration with manufacturing teams.
The role emphasizes teamwork, robust reporting, and the ability to present findings in meetings. Fresh graduates welcome, with semiconductor exposure a plus.
Visit customer to understand requirement and gather market information.
Develop or finetune products to satisfy customer's need.
Prepare samples for customer's evaluation.
Provide technical advice and collaborate with customer to resolve technical issues.
Initiate trial run in preparation for mass production of new product.
Collaborate with Manufacturing Team for smooth new product launching.
Implement and maintain 5S practices in the workplace for optimal organization and efficiency.
Requirements
The candidate must possess at least a Bachelor's Degree/Professional Degree in Chemical Engineering, Pure Chemistry, Material Science or any related Engineering field.
Fresh graduates are welcome to apply and Junior Engineer with working experience in the Semiconductor Industry will be an added advantage.
Showcase a teamwork player attitude and pleasant personality.
Able to demonstrate suitable aptitude for rigorous product development activities and troubleshooting skills.
Able to actively participate in meetings / presentations for internal and external parties.
Proficient at multitasking, good stress management and reporting skills.
Required language(s): Bahasa Malaysia & English.
Required Skill(s): good reporting skills, pleasant personality, ability to converse in English fluently, eagerness to learn, willingness to take on challenges, and a positive attitude.
Chemicals & Plastics Manufacturing 101-1,000 employees
Established in 1989 and rebranded in 2023, Resonac Materials Malaysia Sdn Bhd, formerly known as Showa Denko Materials (Selangor) Sdn Bhd is the leading company in Epoxy Encapsulation Molding Compound in Southest Asia and a supplier to all major semiconductor industries in Malaysia and worldwide.
Established in 1989 and rebranded in 2023, Resonac Materials Malaysia Sdn Bhd, formerly known as Showa Denko Materials (Selangor) Sdn Bhd is the leading company in Epoxy Encapsulation Molding Compound in Southest Asia and a supplier to all major semiconductor industries in Malaysia and worldwide.
Perks and benefits Medical Dental Parking Canteen Coupon, Fitness Class, Company-Sponsored B
What can I earn as a Research and Development Engineer