Quality & Reliability Engineer, Packaging & WLA (Hybrid)

Intel Corporation

Penang

Hybrid

MYR 134,000 - 201,000

Full time

14 days+

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Benefits offered by this job

Hybrid work model

Job summary

Intel Corporation in Penang seeks a Manufacturing Quality and Reliability Engineer to join the Foundry QnR team. You will ensure quality from wafer fabrication to packaging and assembly, driving robust controls, and continuous process improvements.

You will interface with packaging substrates and 2.5D EMIB technology to safeguard yield and reliability. The role emphasizes collaboration across fab, substrates, test, and engineering teams, with a focus on early excursion detection, SPC-based

Qualifications

  • Bachelor’s or Master’s degree in Materials Science, Physics, Chemical Engineering, Mechanical Engineering, or a related field with relevant semiconductor manufacturing experience.
  • At least 3 years of relevant work experience in semiconductor manufacturing (wafer-level assembly WLA, Die prep, packaging Substrates).
  • Experience in quality and reliability methodologies, excursion management, and failure mode analysis.
  • Proficiency in statistics and data analytics tools for quality and reliability assessments.
  • Familiar with QnR Quality Systems and tools.
  • Effective verbal and written communication, and effective meetings skills.
  • Motivated self-starter and self-driven learner to develop skills across semiconductor and assembly processes.
  • Demonstrate strong Quality and Zero-defect mindset and Intel values.

Responsibilities

  • Apply Advanced Packaging expertise to assess inline process health, excursion impact, yield risk, defect mechanisms, and downstream packaging implications.
  • Collaborate with cross-functional teams on root cause analysis and corrective/preventive actions using 8D methodologies.
  • Partner with fab manufacturing, substrates assembly, test, process engineering, and quality teams to strengthen excursion detection and in-line controls.
  • Drive quality control improvements with SPC, Pareto analysis, control plans, and excursion prevention indicators across FAB, substrate, and assembly steps.
  • Support excursion management, MRB facilitation, containment strategies, and communication with Foundry partners and Intel customers.
  • Provide input on thermomechanical interactions to support risk assessment and technical decisions.
  • Own and improve material disposition RFCs, Rel monitors, and QA best practices.
  • Support technology certification and transfer activities with development and ramp partners.
  • Use data extraction and statistical analysis tools and scripting to flag risks.
  • Represent Quality and Reliability as the voice of the customer in internal forums.

Skills

Quality management
Statistical analysis
Root cause analysis
Effective communication

Education

Bachelor’s or Master’s in Materials Science/Physics/Chemical/Mechanical Engineering

Tools

QnR Quality Systems
Data analytics tools
Custom scripting

Job description

Intel Corporation in Penang seeks a Manufacturing Quality and Reliability Engineer to join the Foundry QnR team. You will ensure quality from wafer fabrication to packaging and assembly, driving robust controls, and continuous process improvements.

You will interface with packaging substrates and 2.5D EMIB technology to safeguard yield and reliability. The role emphasizes collaboration across fab, substrates, test, and engineering teams, with a focus on early excursion detection, SPC-based

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