Process/ Equipment Engineer (Advanced Packaging- Fan Out)

TF-AMD Penang; Penang; On-site; MYR 90,000 - 125,000; Full time

Job summary

TF-AMD Penang is seeking a qualified engineer to lead process technology and equipment maintenance for semiconductor manufacturing. You will collaborate with other teams to implement department needs, debug process parameters, and update SOPs.

The role requires a bachelor’s in science/engineering, 3+ years in wafer-level processes, strong English communication, and solid knowledge of SPC, FMEA, and DOE. Batu Kawan site experience is preferred.

Qualifications

• Bachelor’s degree in Science and Engineering related majors.
• More than 3 years of experience in related key areas modules and wafer level processes.
• Good communication in English and proficiency in MS Office.
• Basic knowledge of FMEA and DOE.
• Understand SPC principles and perform relevant analyses.
• Master quality management knowledge and tools including SPC, 8D, and DOE.
• Familiar with MSA.
• Acquire expertise in process/workflow of relevant operations, understanding process requirements, product quality benchmarks, and materials.
• Be well-versed in equipment performance, operation, and debugging.
• Understand electrostatic discharge precautions and requirements.
• Strong self-discipline and teamwork skills.
• Able to work at Batu Kawan site.

Responsibilities

• Do well in the process technology and maintenance of equipment and materials.
• Liaise with other teams to improve and implement their needs within the department.
• Process parameter debug and optimization
• Define work specifications for production line OP and update SOP
• Improve yield and SPC
• Optimize and maintain FMEA/OCPA/SPEC
• Evaluate new materials and machines
• Identify and define product defects

Skills

English communication

MS Office proficiency

Quality management

FMEA

DOE

SPC

8D problem solving

Teamwork

Self-discipline

Education

Bachelor's degree in Science/Engineering

Tools

MS Office

Job description

Responsibilities:

• Do well in the process technology and maintenance of equipment and materials.


• Responsible for liaising with other teams to improve and implement their needs within the department.


• Process parameter debug and optimization


• Responsible for the work specification definition of production line OP and update the SOP


• Responsible for yield and SPC improvement


• Responsible for the optimization and maintenance of FMEA/OCPA/SPEC


• Evaluation of new materials and machines


• Identification and definition of product defects

Key Areas Involved:

• Photolithography; or


• Sputtering / Electroplating / Etching; or


• Yield / SPC improvement; or


• Grinding / Dicing; or


• FCBGA / COW

Requirements:

• Bachelor's degree in Science and Engineering related majors


• More than 3 year of experience in related key areas modules and wafer level processes


• Good communication in English and proficiency in MS office.


• Basic knowledge of FMEA and DOE.


• Understand SPC principles and possess the ability to perform relevant analyses.


• Master quality management knowledge and common analysis tools, including SPC, 8D, and DOE.


• Familiar with MSA.


• Acquire expertise in the process and workflow of relevant operations, understanding process requirements, product quality benchmarks, and the materials in use.


• Be well-versed in the performance, operation, and debugging methods of equipment.


• Understand electrostatic discharge precautions and requirements.


• Strong self-disciplined and teamwork skills.


• Able to work in Batu Kawan site