Process Engineer – IC/Semiconductor Yield & DOE Expert

Vishay Intertechnology, Inc.; Malacca City; On-site; MYR 60,000 - 120,000; Full time

Job summary

Vishay Semiconductor Malaysia Sdn. Bhd. in Melaka invites a Process Engineer to join our IC/semiconductor manufacturing team in Krubong.

You will lead pre-assembly processes, die bond and wire bond operations, and drive yield improvement through DOE, RCA, and cross-functional collaboration. You must hold a Bachelor’s degree in engineering and at least five years’ experience in semiconductor environments, with hands-on knowledge of wire bond, die attach, DOE and SPC tools.

Qualifications

• Bachelor’s degree in Mechanical / Manufacturing / Electrical / Electronic engineering.
• Minimum 5 years of relevant working experience in IC/semiconductor environment.
• Experience in Wire Bond, Die Attach and Pre-Assembly.
• SPC, QCC 7 tools, DOE and problem-solving skills.
• Material, Process and Specification writing knowledge.
• Experience in process engineering and project management is an added advantage.

Responsibilities

• Pre-Assembly process.
• Die Bond & Wire Bond process.
• Process troubleshooting & optimization.
• Yield improvement & defect reduction.
• Root Cause Analysis (RCA).
• Cross-functional collaboration.
• Process optimization, simplification, and improvement.
• Establish Design of Experiment (DOE) for process improvement projects.
• Evaluate, study raw materials for cost saving, quality and shorten process lead-time.
• Perform root cause analysis study for improvement and process sustainability.
• Perform line audit to detect line discrepancy.

Skills

Wire Bond

Die Attach

Pre-Assembly

DOE

SPC

Education

Bachelor’s Degree in Mechanical / Manufacturing / Electrical / Electronic engineering

Tools

DOE methods

Job description

Vishay Semiconductor Malaysia Sdn. Bhd. in Melaka invites a Process Engineer to join our IC/semiconductor manufacturing team in Krubong.

You will lead pre-assembly processes, die bond and wire bond operations, and drive yield improvement through DOE, RCA, and cross-functional collaboration. You must hold a Bachelor’s degree in engineering and at least five years’ experience in semiconductor environments, with hands-on knowledge of wire bond, die attach, DOE and SPC tools.