Process Engineer

ASE Global; Bayan Lepas; On-site; MYR 60,000 - 120,000; Full time

Job summary

ASE Global in Penang, Malaysia seeks an engineer to support and sustain semiconductor manufacturing processes, aiming for excellence in quality, yield, productivity, cost, and reliability.

You will investigate issues with structured problem solving and data-driven root cause analysis, plan DOE studies, support NPI and technology transfers, and collaborate across cross-functional teams to deliver robust process improvements.

Qualifications

• Bachelor’s degree in engineering (Mechanical, Materials, Manufacturing, Chemical, Electrical/Electronics, or related disciplines).
• Min. 2 years of experience in semiconductor manufacturing environment.
• Strong ownership, resilience, learning agility, and analytical problem-solving skills, with the ability to drive technical challenges to closure.
• Ability to work effectively in a fast-paced environment with changing priorities and evolving technical challenges.
• Strong communication and stakeholder management skills with the ability to collaborate across cross-functional teams.
• Knowledge of process improvement, DOE, problem solving methodologies is a must.
• Experience or exposure to package/process development, technology qualification, or advanced packaging is an advantage.

Responsibilities

• Support and sustain manufacturing processes to achieve targets in quality, yield, productivity, cost, and reliability.
• Investigate and resolve process-related issues through structured problem-solving, root cause analysis, and data-driven methodologies.
• Drive continuous improvement initiatives through process optimization, yield enhancement, defect reduction, waste elimination, and automation.
• Plan and execute engineering studies, DOE, and process characterization activities to improve process capability, robustness, and manufacturability.
• Support the evaluation and qualification of new materials, equipment, and process technologies to improve manufacturing capability.
• Support New Product Introduction (NPI), process/package development, technology transfers, and qualification activities from development to ramp.
• Analyze manufacturing, process, and reliability data to identify opportunities for process improvement and technology advancement.
• Collaborate with cross-functional teams to implement process improvements and execute development projects.
• Participate in process and package development activities to support future technology and business requirements.

Skills

Root cause analysis

DOE

Data analysis

Cross-functional

Problem solving

Process optimization

Manufacturing excellence

Education

Bachelor’s degree in engineering

Tools

Process equipment

Job description

• Support and sustain manufacturing processes to achieve targets in quality, yield, productivity, cost, and reliability.
• Investigate and resolve process-related issues through structured problem-solving, root cause analysis, and data-driven methodologies.
• Drive continuous improvement initiatives through process optimization, yield enhancement, defect reduction, waste elimination, and automation.
• Plan and execute engineering studies, DOE, and process characterization activities to improve process capability, robustness, and manufacturability.
• Support the evaluation and qualification of new materials, equipment, and process technologies to improve manufacturing capability.
• Support New Product Introduction (NPI), process/package development, technology transfers, and qualification activities from development to ramp.
• Analyze manufacturing, process, and reliability data to identify opportunities for process improvement and technology advancement.
• Collaborate with cross-functional teams to implement process improvements and execute development projects.
• Participate in process and package development activities to support future technology and business requirements.

Qualification/Requirement

• Bachelor’s degree in engineering (Mechanical, Materials, Manufacturing, Chemical, Electrical/Electronics, or related disciplines).
• Min. 2 years of experience in semiconductor manufacturing environment.
• Strong ownership, resilience, learning agility, and analytical problem-solving skills, with the ability to drive technical challenges to closure.
• Ability to work effectively in a fast-paced environment with changing priorities and evolving technical challenges.
• Strong communication and stakeholder management skills with the ability to collaborate across cross-functional teams.
• Knowledge of process improvement, DOE, problem solving methodologies is a must.
• Experience or exposure to package/process development, technology qualification, or advanced packaging is an advantage.