Plating/Wet Process Engineer

STMicroelectronics; Muar; On-site; MYR 78,000 - 123,000; Full time

Job summary

Jora Malaysia is seeking a skilled Process Engineer to sustain, improve, and optimize plating and resist stripping processes in a high-volume semiconductor environment. You will provide daily engineering support, monitor key parameters, and drive continuous improvement to achieve high yields and stable manufacturing performance.

Responsibilities include troubleshooting excursions, leading root-cause analyses with structured tools (8D, 5 Why, Fishbone Diagram, DOE, SPC), and collaborating across

Qualifications

• Bachelor’s degree in engineering or related field.
• 2–5 years of manufacturing or semiconductor process engineering experience.
• Hands-on electroplating experience highly preferred.
• Experience in resist stripping, wet chemical processes, surface treatment, or semiconductor plating is a plus.

Responsibilities

• Sustain, improve, and optimize plating and resist stripping processes to ensure stable manufacturing performance, high product yield, and continuous improvement.
• Provide daily engineering support for plating and resist stripping processes in a high-volume manufacturing environment.
• Monitor and optimize key process parameters to ensure product quality, process stability, and yield performance.
• Troubleshoot process excursions, defects, and equipment issues and implement corrective actions.
• Lead root cause analyses and continuous improvement using 8D, 5 Why, Fishbone, DOE, and SPC.
• Drive yield improvement, defect reduction, and manufacturing efficiency projects.
• Establish and maintain process specs, SOPs, Control Plans, PFMEA, and reaction plans.
• Support process qualification, changes, NPI, and equipment/process improvement.
• Collaborate with Production, Maintenance, Quality, Facilities, and suppliers to resolve issues and improve performance.
• Ensure compliance with quality systems, safety, and manufacturing standards.

Skills

Electroplating

Process optimization

SPC

DOE

FMEA

8D

Root cause analysis

Yield improvement

Troubleshooting

Data analysis

Independent work

Education

Bachelor’s degree in Chemical/Materials/Mechanical/Semiconductor Engineering

Job description

Jora Malaysia will close on 9th September 2026. Thank you for being with us, we are cheering you on as you continue your career journey.

Responsible for sustaining, improving, and optimizing plating and resist stripping processes to ensure stable manufacturing performance, high product yield, and continuous process improvement.

Provide daily engineering support for plating and resist stripping processes in a high-volume manufacturing environment.

Monitor and optimize key process parameters to ensure product quality, process stability, and yield performance.

Troubleshoot process excursions, defects, and equipment-related issues and implement effective corrective and preventive actions.

Lead root cause analysis and continuous improvement activities using structured problem-solving tools such as 8D, 5 Why, Fishbone Diagram, DOE, and SPC.

Drive yield improvement, defect reduction, process capability, cycle time, and manufacturing efficiency projects.

Establish and maintain process specifications, SOPs, Control Plans, PFMEA, and reaction plans.

Support process qualification, process changes, new product introduction, and equipment/process improvement activities.

Work closely with Production, Maintenance, Quality, Facilities, and external suppliers to resolve technical issues and improve process performance.

Ensure compliance with company quality systems, safety requirements, and manufacturing standards.

YOUR SKILLS & EXPERIENCES

• Bachelor’s degree in Chemical Engineering, Materials Engineering, Mechanical Engineering, Semiconductor Engineering, or a related discipline.
• Minimum 2–5 years of relevant manufacturing or semiconductor process engineering experience.
• Hands-on experience in electroplating processes is strongly preferred.
• Experience in resist stripping, wet chemical processes, surface treatment, or semiconductor plating processes is an advantage.
• Knowledge of process control, SPC, DOE, FMEA, Control Plan, and structured problem-solving methodologies.
• Strong analytical, troubleshooting, and problem-solving skills.
• Experience in electroplating process optimization and troubleshooting.
• Knowledge of plating thickness and uniformity control.
• Experience in chemical bath monitoring and process control.
• Familiarity with resist stripping and wet chemical processes.
• Demonstrated ability to drive yield improvement and defect reduction.
• Able to work independently and effectively in a fast-paced manufacturing environment.