Pick & Place Process Engineer - Die Prep

Intel Corporation; Kulim; On-site; MYR 60,000 - 120,000; Full time

Job summary

Intel Corporation in Malaysia is seeking a Process and Equipment Engineer specializing in Pick and Place (PnP) to own performance, capability, and stability of high-precision assembly equipment within the Die Preparation factory.

You will tackle electro-mechanical challenges, optimize high-speed PnP processes, and implement innovative solutions in a dynamic, high-volume environment, collaborating with global teams on NPI and process improvements.

Qualifications

• Bachelor/Master degree in Electrical / Electronics / Mechanical/ Mechatronics and Materials Engineering with 2+ years of work experience.
• Fresh graduates are welcome to apply.
• Experience in semiconductor back-end assembly, especially Die Preparation and pick and place (PnP) is advantageous.
• Strong knowledge of SPC, DOE, FMEA, RCA and data analysis.
• Good communication skills for cross-functional collaboration and presenting technical data.

Responsibilities

• Process Optimization - Own, stabilize, and optimize pick and place, PnP process parameters, drive yield improvement.
• Equipment Engineering - Lead complex troubleshooting, preventive/corrective maintenance, and vendor collaboration to upgrade hardware/software.
• Data and Yield Analysis - Use SPC, DOE, Design of Experiments, DOE, FMEA to identify root causes of drift or failures.
• Cross-Functional Collaboration - Partner with upstream/downstream process owners and R&D to transfer and ramp new products (NPI).
• Documentation and Standards - SOPs, troubleshooting guides, and progress updates to factory stakeholders.

Skills

Process optimization

Cross-functional collaboration

Data analysis

Problem solving

Education

Bachelor/Master Degree in Electrical / Electronics / Mechanical/ Mechatronics and Materials Engineering

Tools

SPC (Statistical Process Control)

DOE (Design of Experiments)

FMEA (Failure Mode and Effects Analysis)

RCA (Root Cause Analysis)

Job description

Intel Corporation in Malaysia is seeking a Process and Equipment Engineer specializing in Pick and Place (PnP) to own performance, capability, and stability of high-precision assembly equipment within the Die Preparation factory.

You will tackle electro-mechanical challenges, optimize high-speed PnP processes, and implement innovative solutions in a dynamic, high-volume environment, collaborating with global teams on NPI and process improvements.