Packaging Engineer

SanDisk; Simpang Ampat; On-site; MYR 120,000 - 180,000; Full time

Job summary

Sandisk in Penang, Malaysia seeks an SSD packaging integration engineer to drive new product development from concept to mass production. You will lead design optimization, validate options, and deliver manufacturable, high-yield packaging solutions.

Collaborating with global teams across the US, India, Korea and Israel, you will perform DFx analyses, manage assembly flow, and ensure readiness for high-volume production while meeting cost and quality targets.

Qualifications

• Bachelor’s degree with ≥4 years in a relevant field or MSc in engineering.
• Strong understanding of SMT, PCB assembly and reliability.
• Knowledge of design for manufacturability and process control.

Responsibilities

• Lead SSD packaging projects from concept to mass production.
• Collaborate with global teams to validate designs and optimize yield.
• Develop qualification plans and monitor process reliability and costs.

Skills

Problem solving

Statistical analysis

Python

SQL

Education

BSc/BEng or MSc

Tools

Python

SQL

SMT

PCB assembly

Job description

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

You will work as SSD (Solid State Drive) package integration engineer in packaging engineering group. Leads new SSD product development from concept design and qualification to mass production. Generate innovative product concepts and transform them into tangible, market-ready products.

Work closely with global functional teams in US, India, South Korea, and Israel, review feasibility design drawings and propose design options. Collaborate extensively with internal teams, validate design options through characterization builds, perform comprehensive DFX (Design for eXellence) analysis, including DFM (Design for Manufacturability), DFA (Design for Assembly), DFRW (Design for Rework), as well as Cost and UPH (unit per hour) analysis, review mechanical and electrical simulations, initiate assembly process flow, and deliver most optimized design for manufacturing with yield and quality.

Ensuring build readiness, execute package qualification plan, follow up package reliability status, investigate and close failures on time. Monitor assembly and test yield on engineering/customer sample and low volume production builds. Drive yield improvement and manage excursions.

Lead new product from low volume to high volume production transition with yield and quality meeting goals. Ensure FMEA, SOD, Control Plan, recipe guideline, SPC and other assembly controls are ready prior to high volume production. Lead new technology transition (new wafer tech/process/material) from engineering stage to volume production.

Qualifications

• Bachelor’s degree with at least 4 years of relevant work experience, or Master’s degree in material science, mechanical engineering, computer science, or other engineering disciplines.
• Proficient understanding of packaging domains such as SMT, PCB assembly, solder joint reliability, board level reliability, packaging materials, failure analysis, and PCB layout. Additional knowledge in areas like die attach, wire bond, wafer thinning, and molding is a plus.

Preferred

• Self-motivated and self-directed.
• Strong work ethic, capable of performing effectively under high-pressure situations, and maintaining composure in the face of uncertainties.
• Excellent communication skills, enabling collaboration with global functional teams.

Skills

• Exceptional problem-solving skills with expertise in experimental design and statistical analysis.
• Experience with programming languages such as Python or SQL is a plus.

Additional Information Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [e-mail] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.