Packaging Engineer

Sandisk Corporation

Batu Kawan

Remote

MYR 120,000 - 240,000

Full time

3 days ago
Be an early applicant

A complete application in a minute

Tailored resume and cover letter, ready to send.

Get past ATS filters

Job summary

Sandisk is seeking an SSD package integration engineer in the packaging engineering group in Malaysia. You will lead new SSD product development from concept through mass production, collaborating with global teams to evaluate designs, run DFX analyses, and optimize manufacturing processes for yield and quality.

Responsibilities include ensuring build readiness, executing qualification plans, monitoring yield, and driving improvements during transitions from low to high volume production, while

Qualifications

  • Bachelor’s degree with at least 4 years of relevant work experience, or Master’s degree in material science, mechanical engineering, computer science, or other engineering disciplines.
  • Proficient understanding of packaging domains such as SMT, PCB assembly, solder joint reliability, board level reliability, packaging materials, failure analysis, and PCB layout.

Responsibilities

  • Lead new SSD product development from concept design and qualification to mass production.
  • Collaborate with global teams (US, India, SK, Israel) to review feasibility and options, support DFX and cost analyses.
  • Ensure build readiness, execute package qualification, monitor yield, and drive improvements for high-volume production.

Skills

Problem-solving
Python/SQL

Education

Bachelor’s or Master’s degree in a relevant engineering field

Job description

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

Description
ESSENTIAL DUTIES AND RESPONSIBILITIES

You will work as SSD (Solid State Drive) package integration engineer in packaging engineering group. Leads new SSD product development from concept design and qualification to mass production. Generate innovative product concepts and transform them into tangible, market-ready products.

Work closely with global functional teams in US, India, South Korea, and Israel, review feasibility design drawings and propose design options. Collaborate extensively with internal teams, validate design options through characterization builds, perform comprehensive DFX (Design for eXellence) analysis, including DFM (Design for Manufacturability), DFA (Design for Assembly), DFRW (Design for Rework), as well as Cost and UPH (unit per hour) analysis, review mechanical and electrical simulations, initiate assembly process flow, and deliver most optimized design for manufacturing with yield and quality.

Ensuring build readiness, execute package qualification plan, follow up package reliability status, investigate and close failures on time. Monitor assembly and test yield on engineering/customer sample and low volume production builds. Drive yield improvement and manage excursions.

Lead new product from low volume to high volume production transition with yield and quality meeting goals. Ensure FMEA, SOD, Control Plan, recipe guideline, SPC and other assembly controls are ready prior to high volume production. Lead new technology transition (new wafer tech/process/material) from engineering stage to volume production.

Qualifications
REQUIRED
  • Bachelor’s degree with at least 4 years of relevant work experience, or Master’s degree in material science, mechanical engineering, computer science, or other engineering disciplines.
  • Proficient understanding of packaging domains such as SMT, PCB assembly, solder joint reliability, board level reliability, packaging materials, failure analysis, and PCB layout. Additional knowledge in areas like die attach, wire bond, wafer thinning, and molding is a plus.
PREFERRED
  • Self-motivated and self-directed.
  • Strong work ethic, capable of performing effectively under high-pressure situations, and maintaining composure in the face of uncertainties.
  • Excellent communication skills, enabling collaboration with global functional teams.
SKILLS
  • Exceptional problem-solving skills with expertise in experimental design and statistical analysis.
  • Experience with programming languages such as Python or SQL is a plus.
Notice to Candidates

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us atjobs.accommodations@sandisk.comto advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

Additional Information

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution. Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at jobs.accommodations@sandisk.com to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

If you're using NVDA, press NVDA key + space to enable focus mode to read the slider properly.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Packaging Engineer
Packaging Engineer

SanDisk • Simpang Ampat

On-site
MYR 120,000 - 180,000
Senior Engineer, Packaging Engineering
Senior Engineer, Packaging Engineering

SanDisk • Simpang Ampat

On-site
MYR 120,000 - 180,000
Engineer, Packaging Engineering
Engineer, Packaging Engineering

SanDisk • Simpang Ampat

On-site
MYR 90,000 - 150,000
Staff Engineer, Packaging Engineering, Structural Simulation
Staff Engineer, Packaging Engineering, Structural Simulation

SanDisk • Penang

On-site
MYR 120,000 - 210,000
Senior Packaging Engineer
Senior Packaging Engineer

SanDisk • George Town

On-site
MYR 60,000 - 100,000
Advanced Engineering Support Technician
Advanced Engineering Support Technician

Sandisk Corporation • Batu Kawan

Remote
MYR 60,000 - 90,000
Packaging Engineer (Die Attach)
Packaging Engineer (Die Attach)

SanDisk • Simpang Ampat

On-site
MYR 75,000 - 135,000
Engineer, Packaging Engineering (Mechanical Design)
Engineer, Packaging Engineering (Mechanical Design)

SanDisk • Penang

On-site
MYR 90,000 - 140,000
Senior Packaging Engineer
Senior Packaging Engineer

SanDisk • Batu Kawan

On-site
MYR 60,000 - 100,000
Master Lead Engineering Support Technician, Packaging Engineering
Master Lead Engineering Support Technician, Packaging Engineering

SanDisk • Simpang Ampat

On-site
MYR 50,000 - 80,000