NPI Process Development Engineer

NXP Semiconductors NV; Kuala Lumpur; On-site; MYR 270,000 - 360,000; Full time

Job summary

NXP Semiconductors in Malaysia is seeking a Packaging Development Engineer to develop and qualify LQFP and BGA packages for total assembly in automotive applications.

You will drive quality, yield, cost, and process improvements, maintain documentation, and collaborate with cross-functional teams to resolve issues and align project directions with upper management.

Qualifications

• 3-6 years of work experience in semiconductor assembly for automotive customers.
• Hands-on experience with LQFP, MAPBGA, SiP, FCCSP, FCBGA and related packaging development.
• Strong knowledge of laser dicing, plasma dicing, die bond, wire bonding and mold processes.
• Good SPC and process control skills; statistical problem solving.
• Excellent interpersonal and leadership abilities; self-driven.

Responsibilities

• Develop and qualify new LQFP and BGA packages for total assembly processes in automotive applications.
• Maintain quality, yield, cost, and drive process improvements.
• Create and update process documentation, specs, and standard work instructions (OCAP, QIT).
• Collaborate closely with cross-functional teams to resolve conflicts and make quick decisions.
• Take ownership to align scope and direction of key projects with upper management.

Skills

Semiconductor assembly

LQFP

MAPBGA

SiP

FCCSP

FCBGA

Process characterization

Laser dicing

Plasma dicing

Die bond

Wire bonding

Mold

Ball attach

Singulation

Leadership skills

Problem solving

Tools

PowerPoint

Excel Macro

Word

Job description

Responsibilities

• Responsible to develop and qualify new LQFP & BGA packages for total assembly processes in automotive applications.
• Responsible for quality , yield , cost and process improvement activities.
• Responsible for process documentation , process spec , standard work instruction , OCAP , QIT etc.
• Need to collaborate closely with cross functional team members to resolve conflicts and make fast decision to avoid any risk to the organization/company/customer.
• Take ownership to work closely with upper management to align scope and direction of key projects.

Requirements

• 3-6 years of work experience with semiconductor assembly background for automotive customers.
• Experience in LQFP, MAPBGA , SiP , FCCSP , FCBGA etc. packing development will be an added advantage.
• Good technical knowledge and hands‑on experience in process characterization for key processes such as laser dicing , plasma dicing , mechanical saw , die bond , wire bonding , mold , ball attach , marking , singulation etc.
• Candidate must have great interpersonal skills, leadership skills, result orientated, self-driven and eager to strive for success.
• Good SPC, Process Control and other relevant statistical & problem‑solving skills
• Good in Microsoft application (PowerPoint, Excel Macro, Word, etc.). Project Management knowledge is an added advantage.

More information about NXP in Malaysia…

#LI-633a