NPI & Mass-Production Product Engineer

Chipbond Technology Malaysia; Penang; On-site; MYR 39,000 - 61,000; Full time

Job summary

Chipbond Technology Malaysia is seeking an enthusiastic engineer to drive product integration from customer design through pilot and mass production. You will serve as the main technical interface for customers and internal teams across frontend, backend and testing, ensuring clear PCN/ECN communications and readiness for mass production.

You will lead cross‑department problem solving, monitor yield and quality trends in mass production, and push for yield improvements, cycle time reductions and

Qualifications

• Bachelor’s degree in an related engineering field.
• Fresh graduates are encouraged to apply.

Responsibilities

• Oversee integration of new products from design to pilot and mass production.
• Act as integration contact for customers, frontend, backend and testing.
• Plan product roadmaps, milestones, and risk plans.
• Lead cross‑department issue resolution on yield loss, parametric and reliability issues.
• Communicate issue conclusions, risk assessments, and improvement plans to customers.
• Monitor mass production yield, cycle time, OEE and quality trends; drive improvements.
• Support process standardization and establishment of best practices.
• Assist in production ramp‑up and line emergencies.

Education

Bachelor's degree in engineering

Tools

AutoCAD

Job description

Chipbond Technology Malaysia is seeking an enthusiastic engineer to drive product integration from customer design through pilot and mass production. You will serve as the main technical interface for customers and internal teams across frontend, backend and testing, ensuring clear PCN/ECN communications and readiness for mass production.

You will lead cross‑department problem solving, monitor yield and quality trends in mass production, and push for yield improvements, cycle time reductions and