NPI Test Development Engineer: High-Yield Semiconductors

FHLB Des Moines; Penang; On-site; MYR 90,000 - 150,000; Full time

Job summary

Microchip Technology Inc. in Penang is seeking a NPI Test Development Product Engineer to join the Communications BU team. You will develop test programs using ATE for package and wafer, collaborating with design teams to optimize test cost and coverage.

You will work with Asia-based engineers on new product introductions and production support, perform characterization across split lots, and contribute to reliability and yield improvement while maintaining quality standards.

Qualifications

• Good understanding of Automated Test Equipment for Quality and Reliability testing.
• Experience in semiconductor test methodologies.
• Strong scripting and programming skills.
• English communication skills.

Responsibilities

• Develop high quality and cost effective Test Program using Automatic Test Equipment (ATE) both at package and wafer form.
• Work across boundaries with design team to perform ATPG vector generation.
• Responsible for test hardware design like probe card, dutboard and burn in board.
• Develop and implement universal test method that is standard/common to all products.
• Perform characterization across split lots using ATE.
• Working with product reliability engineers to define reliability test requirements for individual product and package qualification.
• Perform statistical analysis of test data to demonstrate correlation between lab, ATE and datasheet.
• Support Ops Team on new NPI startup and HVM deployment activity.
• Interface with Manufacturing Operations and engineering teams to address low yield issue in alignment with MRB standard process.
• Reduce the cost by improving yields and reducing test time.

Skills

C

C++

UNIX

Linux

Python

Perl

Scripting

Education

Bachelor's or Master's degree in Electrical and Electronics Engineering

Tools

Advantest 93k

Job description

Microchip Technology Inc. in Penang is seeking a NPI Test Development Product Engineer to join the Communications BU team. You will develop test programs using ATE for package and wafer, collaborating with design teams to optimize test cost and coverage.

You will work with Asia-based engineers on new product introductions and production support, perform characterization across split lots, and contribute to reliability and yield improvement while maintaining quality standards.