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Texas Instruments Incorporated seeks a Process Engineer to lead the digital design of MES-enabled Wire Bond and Die Attach manufacturing processes. A 1-month TI orientation precedes deployment into a 1–2 year MES project team, after which you return to a production role to optimize yield using the new digital framework.
Responsibilities include MES design, control logic, validation with manufacturing and quality, and post-project stabilization leveraging MES data for process improvements.
Texas Instruments Incorporated seeks a Process Engineer to lead the digital design of MES-enabled Wire Bond and Die Attach manufacturing processes. A 1-month TI orientation precedes deployment into a 1–2 year MES project team, after which you return to a production role to optimize yield using the new digital framework.
Responsibilities include MES design, control logic, validation with manufacturing and quality, and post-project stabilization leveraging MES data for process improvements.