Mechanical Design Engineer - Semiconductor

Talent Recruit; Kulai; On-site; MYR 90,000 - 150,000; Full time

Job summary

Talent Recruit is seeking a Mechanical Design Engineer for a client in Senai, Johor, a leading multinational semiconductor platform solutions provider. The role focuses on precision design, modeling, and system packaging for mechanical and electro-mechanical components.

You will work with global engineering teams across Asia, Europe, and the USA, travel as needed, and ensure designs meet safety codes and GD&T standards while supporting PLM/ERP BOM data.

Qualifications

• Bachelor's degree in Mechanical Engineering required.
• 3–5 years of hands-on mechanical design experience, preferably in semiconductor capital equipment, robotics, or aerospace.
• Expert proficiency in CAD tools: SolidWorks, NX or Creo.
• Certified Level 1 GD&T capability.
• Basic experience with FEA or thermal simulation is a plus.
• Strong technical rigor and ability to work under tight deadlines in cross-functional teams.

Responsibilities

• Create and modify complex parametric 3D models and 2D drawings for mechanical components.
• Design integrated mechanical routings, including pneumatic lines, cooling systems, and cable management within high-level assemblies.
• Perform system packaging and high-level assembly (HLA) modeling to ensure spatial efficiency and serviceability.
• Collaborate with global engineering teams across Asia, Europe, and the USA to ensure project alignment.

Skills

SolidWorks

NX

Creo

GD&T Level 1

FEA

Thermal simulation

Cross-functional collaboration

Travel willingness

Education

Bachelor's degree in Mechanical Engineering

Tools

SolidWorks

NX

Creo

Job description

Company Background

We are seeking for a Mechanical Design Engineer for our client, they are a leading multinational semiconductor platform solutions, process equipment and automation technologies provider, with their manufacturing site based in Senai, Johor.

Job Responsibilities

1. Precision Design & Modeling

• Develop and modify complex parametric 3D models and 2D manufacturing drawings for mechanical and electro-mechanical components.
• Design integrated mechanical routings, including pneumatic lines, cooling systems, and cable management within high-level asseblies.
• Perform system packaging and high-level assembly (HLA) modeling to ensure spatial efficiency and serviceability

2. Engineering Analysis & Validation

• Conduct detailed static and dynamic interference analysis to ensure "zero-clash" integration of subsystems.
• Review and execute all designs in accordance with international safety codes and semiconductor industry regulations.
• Design and conduct laboratory tests to evaluate component durability, thermal performance, and mechanical stress.

3. GD&T & Documentation Control

• Apply Geometric Dimensioning and Tolerancing (GD&T) at a Level 1 certification standard to ensure high-precision manufacturing repeatability.
• Manage the formal release of drawings and concomitant documentation, ensuring all Engineering Change Notices (ECN) are accurately recorded.
• Ensure all CAD metadata and Bill of Materials (BOM) are accurately maintained within the company's PLM/ERP systems.

4. Global Collaboration & Support

• Directly analyze and resolve technical issues identified at supplier sites or during internal integration and testing.
• Participate in regular technical syncs with engineering teams in Asia, Europe, and the USA to ensure project alignment.
• Provide technical data analysis to help the management team assess the market demand and feasibility of new product features.

Job Requirements

• Willing to travel abroad on frequent basis for client servicing purposes including US, Europe, South Asia and Southeast Asia regions
• Minimum Bachelor's degree in Mechanical Engineering.
• Minimum 3-5 years of hands-on mechanical design experience, preferably in semiconductor capital equipment, robotics, or aerospace.
• Expert proficiency in CAD tools such as SolidWorks, NX, or Creo.
• Certified Level 1 GD&T capability.
• Basic experience with FEA (Finite Element Analysis) or thermal simulation is a plus.
• Strong technical rigor, resilience under tight deadlines, and ability to work in cross-functional teams.

Only shortlisted candidates will be notified.