Senior Engineer, Product Innovation (Semiconductors)

Infineon Technologies

Malacca City

On-site

MYR 120,000 - 180,000

Full time

14 days+
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Job summary

Infineon Technologies seeks a Senior Engineer Product Development to shape the future of power electronics through advanced semiconductor physics, device characterization, and cross‑functional collaboration across wafer technology, package, and product development teams.

The role emphasizes applying knowledge to resolve issues, support manufacturability, and drive innovations aligned with business objectives.

Qualifications

  • Bachelor's or higher in Electronics, Microelectronics, Physics, or related field.
  • Solid knowledge of semiconductor devices and power switches including silicon, SiC, GaN.
  • Experience in semiconductor industry or academic projects is a plus.
  • Good understanding of statistical analysis in design and data interpretation.
  • Laboratory experience in device characterization is advantageous.
  • Excellent written and verbal communication in English and German.

Responsibilities

  • Apply semiconductor physics to resolve product issues and drive improvements for future releases.
  • Contribute to product innovation through concept development, demonstrators, evaluations, and feasibility studies.
  • Collaborate in wafer technology, package, and product development projects as part of a technical team.
  • Support DOE efforts to ensure manufacturability and optimize performance.
  • Work with Product Marketing and Application Engineering to meet business objectives.
  • Define electrical characterization activities and interpret results with expert teams.

Skills

semiconductor devices
power switches
WBG technologies
English and German communication
problem solving

Education

Bachelor's degree in Electronics/Microelectronics/Physics

Tools

SEM
X-ray
EMMI

Job description

Infineon Technologies seeks a Senior Engineer Product Development to shape the future of power electronics through advanced semiconductor physics, device characterization, and cross‑functional collaboration across wafer technology, package, and product development teams.

The role emphasizes applying knowledge to resolve issues, support manufacturability, and drive innovations aligned with business objectives.

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