Graduate Signal Integrity Engineer - High-Speed Systems

Advanced Micro Devices, Inc.; Penang; Hybrid; MYR 120,000 - 180,000; Full time

Job summary

AMD Penang is seeking a Signal Integrity Design Engineer to define SI specs, model, analyze, and verify performance for current and next-generation server products. You will collaborate with IC Design, Layout, Packaging, Board, Product Engineer, Test Development, Application, and Software teams to address SIPI across die to board levels.

The role requires hands-on experience with high-speed interconnects, 3-D modeling tools, and cross-functional problem solving.

Qualifications

• Strong grasp of high-speed signaling concepts and SI verification.
• Experience with modeling, simulation, and measurement of signal integrity.
• Proven ability to collaborate across IC, board, and package teams.

Responsibilities

• Model, analyze, and verify signal integrity for server products.
• Lead cross-functional projects from die to board level SIPI.
• Develop and validate SI measurement plans and correlate with simulations.
• Deliver channel optimization and document learnings for future reference.
• Support development of next-gen products and methodologies.

Skills

Transmission line theory

S-parameters

Low-voltage signaling

System-level timing analysis

IO buffer modeling

IBIS-like modeling

PCIe ×5 physical layer

LPDDR4/5

Power delivery design

100+ Gig interfaces

Silicon or board design experience

Analog simulation

3-D modeling with ANSYS HFSS/Q3D

2.5-D with ANSYS SIWAVE

Measurement tools (DSO/TDR/VNA/ParBERT

Education

Bachelor’s or Master’s in Electrical Engineering or Computer Engineering

Tools

Seasim

S2eye

HSPICE

ADS

ANSYS HFSS

ANSYS Q3D

ANSYS SIWAVE

DSO

TDR

VNA

ParBERT

Job description

AMD Penang is seeking a Signal Integrity Design Engineer to define SI specs, model, analyze, and verify performance for current and next-generation server products. You will collaborate with IC Design, Layout, Packaging, Board, Product Engineer, Test Development, Application, and Software teams to address SIPI across die to board levels.

The role requires hands-on experience with high-speed interconnects, 3-D modeling tools, and cross-functional problem solving.