Factory Layout Planning Section Head (S-site - Jelapang)

Carsem (M) Sdn. Bhd; Ipoh; On-site; MYR 150,000 - 210,000; Full time

Job summary

Carsem (M) Sdn. Bhd in Ipoh, Malaysia, seeks an experienced Factory Layout Planning Section Head (S-site - Jelapang) to lead layout optimization, line balancing, and capacity planning for Assembly & Test operations.

You will analyze equipment utilization, bottlenecks, and production flow, create CAD layouts, and drive continuous improvement across Production, Engineering, IE, and Operations teams. A Bachelor’s in Engineering with 5–7 years semiconductor experience is required.

Qualifications

• Bachelor's degree required in engineering or related field.
• 5–7 years of semiconductor assembly & test manufacturing experience.
• Knowledge of lean manufacturing, MRP, and capacity modeling.
• Understanding of production line setup, equipment planning, and manufacturing flow.
• Familiar with assembly & test processes and equipment such as Wire Bond, EDM, Die Attach, Molding, Test.
• Experience in factory layout planning, capacity planning and process optimization.
• Proficient in AutoCAD or equivalent CAD software for layout design and modeling.
• Advanced Excel skills with strong analytical and problem-solving abilities.
• Knowledge of OEE, MES, capacity planning systems or manufacturing performance monitoring tools is a plus.
• Strong communication and stakeholder management to lead cross-functional improvement projects.

Responsibilities

• Lead factory layout planning, line balancing, and space optimization initiatives.
• Develop capacity plans to support production demand and future business growth.
• Analyze equipment utilization, production flow, bottlenecks, and operational efficiency.
• Plan and optimize manufacturing resources, including critical Assembly & Test equipment.
• Create and maintain factory layout drawings and models using CAD software.
• Utilize data analytics to identify improvement opportunities and recommend solutions.
• Collaborate with Production, Engineering, Industrial Engineering, and Operations teams on expansion and improvement projects.
• Drive productivity, throughput, and capacity enhancement initiatives through continuous improvement programs.

Skills

Lean manufacturing

Capacity modeling

Production line setup

Equipment planning

Stakeholder management

Problem solving

Data analysis

Education

Bachelor's Degree in Engineering/Industrial/Manufacturing

Tools

AutoCAD

Excel

MRP systems

MES

OEE monitoring tools

Job description

Factory Layout Planning Section Head (S-site - Jelapang)

We are looking for an experienced Facility Layout & Capacity Planning Section Head to lead factory layout optimization, production capacity planning, and continuous improvement initiatives within a semiconductor manufacturing environment. This role is ideal for someone who enjoys turning data into actionable improvements while designing efficient production flows for Assembly & Test operations.

Key Responsibilities:

Lead factory layout planning, line balancing, and space optimization initiatives.

Develop capacity plans to support production demand and future business growth.

Analyze equipment utilization, production flow, bottlenecks, and operational efficiency.

Plan and optimize manufacturing resources, including critical Assembly & Test equipment.

Create and maintain factory layout drawings and models using CAD software.

Utilize data analytics to identify improvement opportunities and recommend solutions.

Collaborate with Production, Engineering, Industrial Engineering, and Operations teams on expansion and improvement projects.

Drive productivity, throughput, and capacity enhancement initiatives through continuous improvement programs.

Job Requirements:

Bachelor's Degree in Engineering, Industrial Engineering, Manufacturing, or related field.

5-7 years of experience insemiconductor Assembly & Test manufacturing.

Knowledge in lean manufacturing techniques, Material Requirements Planning (MRP) systems, and capacity modeling.

Good understanding of production line setup, equipment planning, and manufacturing flow.

Familiar with key Assembly & Test processes and equipment such as Wire Bond, EDM, Die Attach, Molding, Test, and related operations.

Experience in factory layout planning, capacity planning, and process optimization.

Proficient in AutoCAD or equivalent CAD software for layout design and modeling.

Advanced Microsoft Excel skills with strong analytical and problem-solving capabilities.

Knowledge of OEE, MES, capacity planning systems, or manufacturing performance monitoring tools is an added advantage.

Strong communication and stakeholder management skills with the ability to lead improvement projects across functions.

Consumer Electronics Manufacturing More than 10,000 employees

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.

The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.

Product & Services

Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site

S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package

Other Information

VISION

"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"

MISSION

"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"

QUALITY

Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.

PERSONAL DATA PROTECTION

The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.

The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.

Product & Services

Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site

S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQ