Test Planner Manager (Semiconductor Manufacturing)

Carsem (M) Sdn. Bhd; Ipoh; On-site; MYR 120,000 - 180,000; Full time

Benefits offered by this job

Medical

Dental

Parking

Car subsidy

Education support

Job summary

Carsem (M) Sdn. Bhd. seeks an experienced Test Planner Manager to oversee semiconductor test operations, manage customer demand, capacity planning, production scheduling and on-time delivery performance.

You'll work with customers, Production, Test Engineering and cross-functional teams to ensure smooth operations and customer satisfaction. The role requires strong analytical and organizational skills, plus exposure to OSAT environments and MES/ERP systems.

Qualifications

• Experience with test planning, capacity planning and on-time delivery.
• Strong analytical and problem-solving abilities in a manufacturing setting.
• Effective communication with cross-functional teams and customers.

Responsibilities

• Manage customer demand forecasts and test planning schedules.
• Analyze test plans and align capacity with production requirements.
• Monitor test performance and implement recovery plans for delays.
• Coordinate with Test Engineering on new product introductions.
• Manage test capacity, resources, and subcontractor/offshore scheduling.
• Ensure timely processing of engineering lots and NPI/RMA returns.
• Improve On-Time Delivery and inventory management.
• Collaborate with Production, Maintenance and Customer teams.
• Support quarterly demand planning and capacity reviews.
• Lead and develop the planning team to meet objectives.

Skills

Test planning

Capacity planning

Demand forecasting

Analytical thinking

Stakeholder management

Education

Bachelor's degree in Engineering or related field

Diploma/SPM with 10+ years semiconductor experience

Tools

MES

ERP systems

Job description

Test Planner Manager (Semiconductor Manufacturing)

We are seeking an experienced Test Planner Manager (Semiconductor Manufacturing) to support semiconductor test operations by managing customer demand, test capacity planning, production scheduling, and on-time delivery performance. The successful candidate will work closely with customers, Production, Test Engineering, and cross-functional teams to ensure smooth operations and customer satisfaction.

Key Responsibilities

• Manage customer demand forecasts and test planning schedules.
• Analyze test plans and align capacity with production requirements.
• Monitor test performance and implement recovery plans to address delivery gaps.
• Coordinate with Test Engineering on new product introductions and test requirements.
• Manage test capacity, resource allocation, and subcontractor/offshore scheduling.
• Ensure timely processing of engineering lots, NPI lots, RMA/ECPRN returns, and special customer requests.
• Drive On-Time Delivery (OTD) performance and inventory management.
• Collaborate with Production, Maintenance, and Customer teams to optimize workflow and output.
• Support quarterly demand planning and capacity utilization reviews.
• Lead and develop the planning team to achieve operational objectives.

Requirements

• Degree in Engineering or related discipline with 3-5 years' relevant experience, OR Diploma/SPM with 10+ years' experience in the semiconductor industry.
• Experience in semiconductor manufacturing, production planning, test planning, or capacity planning.
• Strong analytical, problem-solving, and organizational skills.
• Excellent communication and stakeholder management abilities.
• Ability to work effectively in a fast-paced manufacturing environment.

Preferred Experience

• Semiconductor Assembly & Test (OSAT) environment.
• Automated planning, MES, or ERP systems.
• Team leadership or supervisory experience.
• Customer-facing planning and delivery management.

Why Join Us?

• Competitive compensation and benefits.
• Career growth and development opportunities.
• Dynamic and collaborative work environment.

Perks and benefits

• Medical Education support Dental Parking Medical for immediate family members, car subsidy

Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.

Product & Services

Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site

S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package

Other Information

VISION

"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"

MISSION

"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"

QUALITY

Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.

PERSONAL DATA PROTECTION

The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.

The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.