Engineering Administrator

CHIPBOND TECHNOLOGY MALAYSIA SDN. BHD.; Batu Kawan; Vor Ort; MYR 36.000 - 60.000; Vollzeit

Zusammenfassung

CHIPBOND TECHNOLOGY MALAYSIA SDN. BHD. is hiring an Engineering Administrator in Batu Kawan, Penang.

This role provides essential administrative support to ensure smooth operation of Production and Engineering processes. The successful candidate will handle onboarding, scheduling, correspondence and inventory tasks within the production environment. Requirements include a Bachelor’s or Diploma in Business Administration, 1+ year experience in production/engineering admin within semiconductor or

Qualifikationen

• Bachelor’s degree or Diploma in Business Administration or related field.
• At least 1 year of experience as production or engineering administrator in semiconductor, manufacturing or EMS sectors; fresh graduates welcome.
• Experience with SAP/BPM is a plus.
• Proficient in Mandarin, English and Bahasa Malaysia (Taiwan liaison).

Aufgaben

• Prepare onboarding items for new production staff and assist in distributing items within production.
• Maintain and organize meeting schedules; prepare meeting minutes.
• Answer emails and phone calls; forward communications to the appropriate parties.
• Regularly check and maintain office supplies inventory.
• Provide general administrative support to the production department.
• Perform any other administrative duties as required to support the production team.

Kenntnisse

Communication

Multitasking

Team collaboration

Ausbildung

Bachelor’s degree in Business Administration

Diploma in Business Administration

Tools

SAP/BPM

Jobbeschreibung

About the role We are seeking a dedicated Engineering Administrator to join the team at CHIPBOND TECHNOLOGY MALAYSIA SDN. BHD. in our Batu Kawan, Penang location. This full-time role will be responsible for providing administrative support to ensure the smooth operation of our Production and Engineering processes.

What you'll be doing

Prepare onboarding items to new production staff and assist in sending item within production department

Maintains and organizes meeting schedules and prepare meeting minutes

Answer and respond to organization emails and phone calls, and forward communications to appropriate parties as necessary

Regularly check and maintain record of necessary office supplies

Perform other administrative duties as required to support the production department

Job Requirements:

1. Bachelor’s degree/ Diploma in Business Administration or related field.

2. At least 1 years or above experiencework as production or engineering administrator in semiconductor industry, manufacturing or EMS industry. Fresh Graduate are encouraged to apply as well.

3. Experienced in SAP/BPM system is an added advantages.

4. Good communication skills in both written and spoken in Mandarin, English and Bahasa Malaysia. (need to deal with Taiwan counterpart)

Unlock job insights

Hirer responsiveness Salary match Number of applicants

Consumer Electronics Manufacturing 101-1,000 employees

Chipbond Technology was founded in July 1997, as a downstream packaging and testing service provider in the semiconductor industry, headquarters in Taiwan, Hsinchu Science Park

We have expanded the operations to 6 locations with approximately 5,200 people

We are one of the few companies in the country that possesses a competitive advantage in the entire process of manufacturing, packaging and testing of driver ICs. Additionally, we are the world's largest packaging and testing facility for display driver ICs and hold a prominent position among the top ten semiconductor packaging and testing companies globally.

We are expanding our footprint to Penang, Malaysia, Let's join us as Pioneer Team!

Chipbond Technology was founded in July 1997, as a downstream packaging and testing service provider in the semiconductor industry, headquarters in Taiwan, Hsinchu Science Park

We have expanded the operations to 6 locations with approximately 5,200 people

We are one of the few companies in the country that possesses a competitive advantage in the entire process of manufacturing, packaging and testing of driver ICs. Additionally, we are the world's largest packaging and testing facility for display driver ICs and hold a prominent position among the top ten semiconductor packaging and testing companies globally.

We are expanding our footprint to Penang, Malaysia, Let's join us as Pioneer Team!

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