Electroplating Process Engineer — Growth & Impact

NXP Semiconductors; Kuala Lumpur; On-site; MYR 60,000 - 96,000; Full time

Job summary

NXP Semiconductors in Malaysia is seeking a Process Engineer to support electroplating processes, drive improvements, and work with maintenance and equipment engineering to troubleshoot issues and plan tooling upgrades. You will generate process documentation, provide training, lead new developments, design tooling, reduce scrap, monitor process stability, and report performance to management.

A chemical/mechanical engineering degree and 2–3 years' experience in a chemical environment are

Qualifications

• Bachelor's degree in Engineering (Chemical/Mechanical) required.
• 2–3 years of related experience preferred; fresh graduates encouraged to apply.
• Comfortable working in a chemical environment.

Responsibilities

• Provide process support for Electroplating processes.
• Drive continual process improvement to boost productivity and capacity.
• Collaborate with maintenance and equipment engineering to troubleshoot issues and plan tooling upgrades.
• Generate and maintain process documentation.
• Lead new developments/projects and liaise with vendors on tooling.

Skills

Process optimization

Troubleshooting

Documentation

Team collaboration

Training

Education

Bachelor's Degree in Engineering (Chemical / Mechanical)

Tools

Plating equipment knowledge

Maintenance planning tools

Job description

NXP Semiconductors in Malaysia is seeking a Process Engineer to support electroplating processes, drive improvements, and work with maintenance and equipment engineering to troubleshoot issues and plan tooling upgrades. You will generate process documentation, provide training, lead new developments, design tooling, reduce scrap, monitor process stability, and report performance to management.

A chemical/mechanical engineering degree and 2–3 years' experience in a chemical environment are