Process Development Staff Engineer (Die Attach)

Ams Osram; Bayan Lepas; On-site; MYR 120,000 - 180,000; Full time

Job summary

ams OSRAM Opto Semiconductors in Penang, Malaysia, seeks an experienced engineer to lead Die Attach process development and technology initiatives. You will drive DA/SMT actions, coordinate cross-functional teams, and ensure manufacturability while optimizing costs and roadmaps.

The role requires 5+ years in DA process development, with LEDs knowledge considered a strong plus. Excellent communication and collaboration skills are essential for success in this global semiconductor environment.

Qualifications

• At least 5 years of working experience in the Die Attach process development/technology.
• Candidates with technical knowledge in LEDs will have a strong advantage.
• Strong analytical and systematic problem-solving abilities, with attention to detail.
• Excellent interpersonal and communication skills to liaise between departments.

Responsibilities

• Lead DA/SMT process development activities for flex foil in development projects.
• Coordinate and industrialize processes and logistics to meet manufacturability requirements.
• Prepare line documentation for manufacturing and audits.
• Understand and optimize product cost and roadmap.

Skills

Analytical skills

Problem-solving

Statistical knowledge

Attention to detail

Interpersonal skills

Communication skills

Education

Bachelor’s degree in Electrical/Electronic Engineering, Mechatronics/Electromechanical, Materials Science, Physics or equivalent

Job description

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the‑art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.

• Leading the DA / SMT process for flex foil in development projects. To meet time, process cost and quality requirements.
• Actively seeking the know-how of DA / SMT process, assembly and material to ensure process and material capabilities are fully considered in Design Review.
• Lead investigation and analysis of problems, yield and drive implementation of solutions.
• Responding and taking necessary actions to address urgent Production and Customer problems.
• Able to coordinate and industrialize processes and logistics that fulfil the manufacturability requirements.
• Able to coordinate and prepare line documentation that can be used for manufacturing and audits.
• Able to understand and optimize the product cost and roadmap.

• Bachelor’s degree in engineering (Electrical/ Electronic), Engineering (Mechatronic/ Electromechanical), Engineering (Material Science), Physics or equivalent.
• At least 5 years of working experience in the Die Attach process development/technology.
• Candidates with technical knowledge in LEDs will have a strong advantage.
• Strong analytical skills, systematic problem-solving approach skills, statistical knowledge, very careful and detailed-oriented personality.
• Must have good interpersonal skills and very good communication skills to liaise between different departments/groups.