Die/Layer Attach Process Development Staff Engineer

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd; Bayan Lepas; On-site; MYR 120,000 - 180,000; Full time

Job summary

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd is seeking a Die/Layer Attach Process Development Staff Engineer to support NPI and deliver process/equipment development solutions. The role emphasizes dual sourcing and cost optimization, plus ongoing improvement of BOM materials and UPH.

The successful candidate will apply hands-on Die Attach/Layer Attach experience, strong analytical skills, and familiarity with JMP, Excel, Word, and PowerPoint to drive technical leadership and problem solving

Qualifications

• Bachelor’s degree in engineering or equivalent.
• 2+ years in semiconductor Die Attach/Layer Attach process engineering.
• Hands-on experience in Die Attach, Layer Attach, and related processes.

Responsibilities

• Support NPI and deliver process/equipment development solutions.
• Drive dual sourcing and cost optimization for equipment.
• Improve BOM material usage and UPH to hit cost targets.
• Lead problem solving using data-driven engineering approaches.
• Share knowledge through internal/external activities.

Skills

Analytical skills

Problem solving

Six Sigma

Education

Bachelor’s Degree in Engineering (Mechanical/Mechatronic/Electromechanical)

Engineering (Material Science)

Physics

Tools

JMP

Excel

Word

PowerPoint

Job description

Die/Layer Attach Process Development Staff Engineer

Support New Product Introduction (NPI), deliver assigned process and equipment development solutions that meet or exceed project quality, cost and timeline targets to ensure successful product industrialization. Drive Equipment Dual Sourcing & Cost Optimization by establishing qualified second-source equipment suppliers and introducing cost-effective processes or technologies to achieve equipment sourcing resilience and cost‑saving objectives aligned with equipment strategy and manufacturing readiness requirements.

Key responsibilities

Support New Product Introduction (NPI) and deliver assigned process and equipment development solutions that meet or exceed project quality, cost and timeline targets

Drive Equipment Dual Sourcing & Cost Optimization by establishing qualified second-source equipment suppliers

Introduce cost-effective processes or technologies to achieve equipment sourcing resilience and cost‑saving objectives

Drive continuous process improvement initiatives focused on BOM material optimization and UPH (Units Per Hour) enhancement to achieve product cost targets

Lead or contribute to the resolution of recurring manufacturing and process challenges by applying innovative, data‑driven engineering solutions

Provide active technical leadership, analysis, and support in team‑based problem‑solving initiatives

Continuously enhance technical expertise by maintaining and updating organizational knowledge relating to design guidelines, process know‑how, equipment capabilities and supplier technologies

Actively participate in internal and external knowledge‑sharing activities, including technical symposiums, conferences, benchmarking sessions, trade shows, and engineering forums

About you

Bachelor's Degree in Engineering (Mechanical/Mechatronic/Electromechanical), Engineering (Material Science), Physics or equivalent

More than 2 years in semiconductor Die Attach/Layer Attach process engineering field

Die Attach, Layer Attach process engineering knowledge and hands‑on skillset in semiconductors or LED manufacturing processes

Hands‑on and process development experience in FOL related processes such as sawing, die attach and wire bond process

Strong analytical skill and systematic problem‑solving approach

Statistical knowledge with knowledge of Six Sigma preferred

In‑depth knowledge of Microsoft Excel, Word, PowerPoint and JMP required

Experience in Process development or New Product Introduction is an advantage

About ams OSRAM

The ams OSRAM Group is a global leader in innovative light and sensor solutions.

With more than 110 years of industry experience, we combine engineering excellence and global manufacturing with a passion for cutting‑edge innovation enabling transformative advancements in the automotive, industrial, medical, and consumer industries.

“Sense the power of light” – our success is based on the deep understanding of the potential of light and distinct portfolio of emitter and sensor technologies. Around 19,700 employees worldwide drive innovations alongside societal megatrends.

The ams OSRAM Group is a global leader in innovative light and sensor solutions.

With more than 110 years of industry experience, we combine engineering excellence and global manufacturing with a passion for cutting‑edge innovation enabling transformative advancements in the automotive, industrial, medical, and consumer industries.

“Sense the power of light” – our success is based on the deep understanding of the potential of light and distinct portfolio of emitter and sensor technologies. Around 19,700 employees worldwide drive innovations alongside societal megatrends.