Design Engineer (Leadframe)

ASE Electronics Malaysia

Bayan Lepas

On-site

MYR 60,000 - 75,000

Full time

5 days ago
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Benefits offered by this job

Annual Leave
Medical and Hospitalisation Leave
EPF
SOCSO
Annual Bonus
Medical Insurance

Job summary

ASE Electronics Malaysia in Bayan Lepas, Penang, requires an engineer to design new leadframe packages and manage related projects. You will contribute to feasibility studies and technical gap analyses, and coordinate with suppliers and customers on design aspects.

The role involves handling drawings for leadframes and attachments, supporting internal/external customers, and participating in audits and APQP activities as part of the team.

Qualifications

  • Degree in related discipline or Diploma with 4 years relevant working experience.
  • Experience in leadframe packaging design is a plus.
  • Relevant project management exposure is desirable.

Responsibilities

  • Design new package types and conduct feasibility study / Technical Gap Analysis.
  • Generate drawing leadframe, copper clip, package outline and strip outline.
  • Generate external bonding diagram.
  • Liaise with supplier and customer related to design.
  • Project Management.
  • Provide technical support to internal and external customer.
  • Assist in internal audit and external audit.
  • Assist in APQP system requirement
  • Any other duties assigned from time to time.

Skills

Project management
Feasibility analysis
Technical gap analysis
Leadframe design

Education

Degree in related discipline or Diploma

Job description

Jora Malaysia will close on 9th September 2026. Thank you for being with us, we are cheering you on as you continue your career journey.

Degree in related discipline or Diploma with 4 years relevant working experience.

Job Overview :

Design new leadframe packages and handle project management.

Requirement
  • Degree in related discipline or Diploma with 4 years relevant working experience.

Job Overview :

Design new leadframe packages and handle project management.

Responsibility
  • Design new package types and conduct feasibility study / Technical Gap Analysis.
  • Generate drawing leadframe, copper clip, package outline and strip outline.
  • Generate external bonding diagram.
  • Liaise with supplier and customer related to design.
  • Project Management.
  • Provide technical support to internal and external customer.
  • Assist in internal audit and external audit.
  • Assist in APQP system requirement
  • Any other duties assigned from time to time.
Benefits
  • Annual Leave
  • Medical and Hospitalisation Leave
  • EPF
  • SOCSO
  • Annual Bonus
  • Medical Insurance
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