ChipFab Process Engineer

Broadcom; George Town; Presencial; MYR 180 000 - 320 000; Tempo integral

Resumo da oferta

Broadcom is seeking an experienced Senior Manufacturing Engineering Leader in Penang, Malaysia to drive ramp-up of new facilities, qualification of CM partners, and seamless NPI-to-HVM transitions. You will own technical issue resolution on the factory floor and lead yield improvement across contract manufacturers.

Ideal candidates have 10+ years in semiconductor/photonics manufacturing, strong leadership, and proficiency with JMP for data analysis.

Qualificações

• Bachelor’s or Master’s degree in a relevant engineering field.
• 10+ years in backend semiconductor/photonics manufacturing or related field.
• Experience leading remote teams and facility ramp-ups.
• Proficiency in data-driven decision making with JMP.

Responsabilidades

• Lead ramp-up of new facilities and ensure capacity scaling within project timelines.
• Oversee qualification and onboarding of CM partners, new equipment, and processes for mass production.
• Drive smooth transfer from NPI to HVM and own product-related technical issues on the floor.
• Monitor CM yields and proactively address low yield, on-hold, and rework rates.
• Resolve CM engineering, production, and quality issues with robust corrective actions.
• Oversee product costing and identify opportunities for cost reductions via process optimization.
• Monitor CM performance metrics and troubleshoot manufacturing deviations with JMP.
• Conduct on-site quality audits at partner facilities and drive root-cause investigations.

Conhecimentos

Leadership

Cross-functional collaboration

Project management

Data analysis

Formação académica

Engineering degree (Mechanical/Electrical & Electronics) or Semiconductor Manufacturing

Ferramentas

JMP software

Descrição da oferta de emprego

• New Facilities & Production Ramp-Up: Lead the team to ramp-up new facilities, ensuring aggressive capacity scaling are consistently achieved within strict project timelines.
• New Equipment, Process & CM Qualification: Lead the cross functional team in the evaluation, qualification, and strategic onboarding of new Contract Manufacturing (CM) partners, new equipment, and manufacturing processes to ensure a seamless transition into mass production.
• New Product Transfer & Technical Ownership: Drive for seamless transition of products from New Product Introduction (NPI) to High-Volume Manufacturing (HVM), acting as the first line of technical defense for all product-related issues on the factory floor.
• Yield Stabilization & Enhancement: Monitor production yields across contract manufacturers. Proactively identify yield issue such as Low Yield Triggered , On-Hold Rate, Rework Rate and drive for improvement.
• Line Sustaining, drive for process yield Improvement : Resolve daily CM engineering, production, and quality issues by implementing robust corrective actions and driving continuous process improvement initiatives.
• Product Costing Management: Oversee product cost analysis and proactively identify opportunities for cost reduction through process optimization, yield enhancement, and cycle time improvements.
• Data-Driven Engineering Analysis: Drive to monitor CM performance metrics and troubleshoot complex manufacturing deviations utilizing advanced analytical software (e.g., JMP).
• Customer Quality Assurance: Conduct rigorous on-site quality audits at partner facilities to enforce strict adherence to Standard Operating Procedures (SOPs), Process Control Plans (PCPs), and overarching quality standards. Drive Contract Manufacturers (CMs) to promptly resolve customer quality issues by leading root cause investigations, implementing robust corrective actions (CA), and tracking their long-term effectiveness.

Job Description

• New Facilities & Production Ramp-Up: Lead the team to ramp-up new facilities, ensuring aggressive capacity scaling are consistently achieved within strict project timelines.
• New Equipment, Process & CM Qualification: Lead the cross functional team in the evaluation, qualification, and strategic onboarding of new Contract Manufacturing (CM) partners, new equipment, and manufacturing processes to ensure a seamless transition into mass production.
• New Product Transfer & Technical Ownership: Drive for seamless transition of products from New Product Introduction (NPI) to High-Volume Manufacturing (HVM), acting as the first line of technical defense for all product-related issues on the factory floor.
• Yield Stabilization & Enhancement: Monitor production yields across contract manufacturers. Proactively identify yield issue such as Low Yield Triggered , On-Hold Rate, Rework Rate and drive for improvement.
• Line Sustaining, drive for process yield Improvement : Resolve daily CM engineering, production, and quality issues by implementing robust corrective actions and driving continuous process improvement initiatives.
• Product Costing Management: Oversee product cost analysis and proactively identify opportunities for cost reduction through process optimization, yield enhancement, and cycle time improvements.
• Data-Driven Engineering Analysis: Drive to monitor CM performance metrics and troubleshoot complex manufacturing deviations utilizing advanced analytical software (e.g., JMP).
• Customer Quality Assurance: Conduct rigorous on-site quality audits at partner facilities to enforce strict adherence to Standard Operating Procedures (SOPs), Process Control Plans (PCPs), and overarching quality standards. Drive Contract Manufacturers (CMs) to promptly resolve customer quality issues by leading root cause investigations, implementing robust corrective actions (CA), and tracking their long-term effectiveness.

Requirement

• Bachelor’s or Master’s degree in Mechanical/Electrical & Electronics Engineering, Semiconductor Manufacturing, Fiber Optics/Photonics Product Engineering, or a related highly technical field.
• Minimum 10+ years of hands‑on engineering and leadership experience in backend Indium Phosphide InP wafer processing (from wafer to chip‑out) or complex semiconductor/photonics manufacturing. Familiarity with Bar Processing such Bar Stacker/unstack, Scribe & Break, AOI, and Pick & Place will be an added advantage.
• Strong leadership capabilities with a proven history of managing remote teams, driving cross‑functional initiatives, and successfully leading new facility or production line ramp‑ups.
• Extensive expertise in product and process yield improvement methodologies, complex problem‑solving, and equipment qualification.
• Highly proficient in JMP software, with a strong capability to leverage it for complex statistical data analysis and critical decision‑making.
• Excellent communication, negotiation, and project management skills, with the ability to influence external partners and internal stakeholders effectively.

R027546