Cadence Allegro PCB Layout Engineer - High-Density Boards

NCS Global Technology Sdn. Bhd.

Penang

On-site

MYR 90,000 - 120,000

Full time

12 days ago

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Job summary

NCS Global Technology Sdn. Bhd. in Penang is seeking a PCB Layout Engineer to design and develop complex multi-layer PCBs using Cadence Allegro, translating schematics into optimized physical layouts.

The role emphasizes high-density routing, signal integrity, power integrity, and close collaboration with mechanical and manufacturing teams to ensure manufacturability and reliable performance.

Qualifications

  • Must have Bachelor’s degree in Electrical/Electronics engineering or related field.
  • Hands-on PCB layout experience with multi-layer PCBs (6+ layers).
  • Proficient with Cadence Allegro PCB Designer and Constraint Manager.
  • Experience creating and maintaining ECAD libraries (footprints/symbols).
  • Familiar with IPC standards and DFM/ DFA principles.

Responsibilities

  • Design and develop complex multi-layer PCB layouts using Cadence Allegro PCB Designer.
  • Perform high-density routing, including differential pairs and impedance control.
  • Define and optimize stack-up, impedance, and material choices.
  • Coordinate with mechanical, SI/PI, and manufacturing teams for robust designs.
  • Create and maintain ECAD libraries and 3D STEP model coordination.
  • Ensure DRC/ERC compliance and manufacturability through reviews.

Skills

Cadence Allegro PCB Designer
Constraint Manager
HDI/6+ layer routing
Differential pair routing
3D STEP models
DFM/ DFA/ DFT
ECAD libraries
Signal/Power integrity
IPC standards knowledge

Education

Bachelor's Degree in Electrical/Electronics Engineering

Tools

Cadence Allegro PCB Designer
Allegro Constraint Manager
3D STEP models
Gerber/ ODB++ workflows

Job description

NCS Global Technology Sdn. Bhd. in Penang is seeking a PCB Layout Engineer to design and develop complex multi-layer PCBs using Cadence Allegro, translating schematics into optimized physical layouts.

The role emphasizes high-density routing, signal integrity, power integrity, and close collaboration with mechanical and manufacturing teams to ensure manufacturability and reliable performance.

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