Assembly Media and Collaterals Development Engineer

Intel; Kulim; On-site; MYR 80,000 - 120,000; Full time

Job summary

Intel in Kulim, Malaysia seeks a seasoned engineer to develop media and collaterals for advanced assembly packaging, applying DOE/ SPC to optimize quality, cost and reliability. You will create, test and document improvements under simulated field conditions and collaborate with cross-functional teams to drive technology maturation.

You will lead design initiatives, advise on materials, and contribute to process optimization with proficiency in AutoCAD/SolidWorks and strong drawing/tolerancing

Qualifications

• Bachelor's or Master's degree in Mechanical Engineering, Material Engineering, Electrical Engineering, or Physics.
• 2+ years of experience applying SPC/DOE to develop novel solutions.
• Experience with AutoCAD, SolidWorks, and other packaging tools.
• Experience with engineering drawing, tolerancing, and design rules.

Responsibilities

• Develop media and collaterals for assembly processes and equipment to enable Intel's roadmap.
• Improve efficiency of manufacturing media and collaterals meeting quality, cost, yield and manufacturability targets.
• Document improvements using DOEs and data analysis; write white papers.
• Develop and maintain equipment to evaluate media under simulated field conditions (heat, humidity, vibration).
• Create techniques and tools to detect early quality/reliability issues in media and collaterals.
• Lead design decisions to meet module needs based on failure mechanism understanding.
• Foster innovation and use experimental design to continuously improve media and collateral quality.
• Consult on design problems in assembly packaging; respond to customer requests.
• Standardize qualification, prototypes and methods; coordinate with packaging tech development teams.

Skills

SPC & DOE principles

engineering drawing

tolerancing analysis

design rules

Education

Bachelor's or Master's in Mechanical Engineering or related field

Bachelor's or Master's in Material Engineering

Bachelor's or Master's in Electrical Engineering

Bachelor's or Master's in Physics

Tools

AutoCAD

SolidWorks

Job description

Responsibilities

• Develop media and collaterals for assembly processes and/or equipment, applying novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
• Optimize and improve the efficiency of manufacturing media and collaterals, developing improvements to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
• Develop media and collateral specifications applying principles for design of experiments and data analysis, and document improvements through white papers.
• Develop and maintain equipment to evaluate media and collateral solutions under simulated field use conditions, such as heat, humidity, vibration, temperature cycle, and dynamic forces.
• Develop new techniques and acceleration methods, tools and quality screens to ensure early identification of potential problems with media and collateral quality and reliability.
• Perform and influence media and collateral design, material selection and prototype development to meet assembly module needs, based on a fundamental understanding of failure mechanisms.
• Lead efforts toward innovation, problem solving, developing, and continuously improving media and collaterals using experimental design and statistical methods.
• Provide consultation concerning design problems and improvements in the assembly packaging process, and respond to customer/client requests or events as they occur.
• Deliver standardization in media and collateral qualification, manufacturing prototypes, and methods, and continuously engage with packaging technology development and partner engineering groups on process/technology maturity for products toward key risk areas in meeting product milestones.

Qualifications

• Possess a Bachelor's or Master's degree in Mechanical Engineering, Material Engineering, Electrical Engineering, or Physics related field.
• Minimum 2 years of experience in fundamental science and engineering concepts in development to create novel solutions, including strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.
• Experience in analytics and design tools in the packaging industry such as AutoCAD, SolidWorks, etc.
• Experience working with engineering drawing, tolerancing analysis, and design rules.

Preferred Qualifications

• Strong mechanical design software experience (SolidWorks, AutoCAD, etc).
• Portfolio of self‑completed concept‑to‑fabrication project examples in assembly equipment, process, media, and/or collateral experience.
• Technical innovation and delivery of results for complex, time‑critical technical projects.
• Understanding of semiconductor fabrication processes and technology with technical and analytical skills.

Job Details

• Job Type: Experienced Hire
• Shift: Shift 1 (Malaysia)
• Primary Location: Malaysia, Kulim

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.