Assembly Backend Technician (System - Tooling )

NXP Semiconductors; Kuala Lumpur; On-site; MYR 42,000 - 64,000; Full time

Job summary

NXP Semiconductors Malaysia is seeking an Assembly Backend Technician (System – Tooling) to maintain Trim & Form systems and tooling in the backend assembly area. You will perform preventive maintenance on system handlers, tooling, and laser markers, and support tooling conversions to meet manufacturing goals.

The role requires a Diploma or equivalent with 5+ years in assembly backend equipment, familiarity with semiconductor processes, and strong problem solving, communication, and discipline.

Qualifications

• Diploma in E&E or Mechanical Eng; or related certificate.
• 5+ years in Assembly Backend equipment.
• Knowledge of semiconductor assembly processes.

Responsibilities

• Maintain and sustain Trim & Form System and Tooling in Assembly Backend.
• Perform preventive maintenance on system handler, tooling and laser marker.
• Support system/tooling conversions to meet manufacturing goals.
• Meet Downtime and MTBA targets for Trim & Form machines.
• Strive for 90% PM success with minimal downtime and quality issues.
• Ensure spare tooling readiness and quick tool changes.
• Oversee maintenance activities and spare parts fabrication.
• Maintain discipline and punctuality with minimal supervision.

Skills

Interpersonal & communication

Problem solving

Discipline & flexibility

Education

Diploma in Electrical & Electronics or Mechanical Engineering (or certificate)

5+ years in Assembly Backend equipment

Semiconductor experience (advantage)

Tools

Assembly Back End equipment

Job description

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Assembly Backend Technician (System - Tooling )

Responsibilities

• a) Maintaining / sustaining Trim & Form System and Tooling in Assembly Backend
• b) To perform a machine periodic Preventive Maintenance for system handler , tooling and laser marker
• c) To perform system and tooling conversion to support Manufacturing goal indices
• d) Meeting Trim & Form machine Downtime and MTBA Goal
• e) Meeting 90% PM success rate . No Machine downtime / No product quality issue after PM.
• f) To perform Tooling Preventive Maintenance and periodic tooling health check inspection
• g) Spare Tool readiness and availability for quick tool changeover
• h) Manage the maintenance activities of machines and fabrication of spare parts.
• i) Good discipline and tardiness with minimum supervise

Requirement

• Diploma in Electrical & Electronics or Mechanical and Engineering discipline, or certificate with min 5 years’ of relevant working experience in Assembly Backend equipment
• Experience in semiconductor assembly and applied statistics will be an advantage
• Have good technical skills on Assembly Back End assembly equipment
• Strong interpersonal and communication skills
• Good decision making / problem solving skills.
• Familiar with production environment & possesses process handling knowledge. (Semiconductor).
• Must be discipline and willing to work long hours and shifts.
• Must adhere NXP Total Quality Mindset and Safety Awareness.
• Must adhere NXP core value Trust and Respect, Collaboration, Ownership, Expertise, Innovation and Growth.