Staff Engineer

Infineon Technologies AG; Tijuana; Presencial; MXN 367,000 - 552,000; Jornada completa

Descripción de la vacante

A global leader in semiconductor solutions is seeking a qualified candidate to define and develop packaging for new technologies. This role requires a Bachelor's degree in engineering and experience in semiconductor packaging. The successful candidate will coordinate cost estimations, scout for new technologies, and serve as the main contact for packaging matters. Join us in driving innovation in energy-efficient semiconductors.

Formación

• Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics) required.
• 5+ years of experience in Semiconductor Packaging, Assembly, and Test is preferred.
• Strong analytical skills with the ability to solve complex problems.

Responsabilidades

• Define and develop package for new products from concept to realization.
• Coordinate package Cost Estimation and Cost Indication.
• Scout new packaging technologies and maintain competitor awareness.

Conocimientos

Analytical and Problem-Solving Skills

Semiconductor Packaging

Experience in Wire bond process

Failure Analysis and Reliability Engineering

Process and Equipment Engineering knowledge

Educación

Bachelor’s Degree in Engineering

Herramientas

AutoCAD

3D drafting

Descripción del empleo

Job Description

In your new role you will:

• Define and develop the right package for new products/technologies from BU/FE from concept, feasibility study until realization.
• Driver for technical definition (BOM, package design, assembly technology, review PRP, project classification, etc) activities for package projects with major changes/new package, risks, and impact.
• Generate conceptual package outline and internal construction drawings, finalise and document the drawings, and update the packaged drawings as needed.
• Define the package characteristics to meet the electrical, thermal, reliability, and mechanical requirements
• Coordinate the package Cost Estimation and Cost Indication
• Contact the partner and technical consultant for package definition to Business Division, especially on BE assembly technology know-how.
• Being the main driver for the DFMEA
• Support pre-development & project definition stage, and continue to be package design expert throughout the project phase
• Actively scout for new packaging technologies and keep in touch with package development at competitors/subcons.
• Main contact person and technical consultant/coach for all questions and discussions regarding packaging, package design, and Package.
• Drive innovation and pre-development activities within the package platform.
• Consolidate the inputs for Assembly Design Rules and ensure the contents are updated
• Drive innovation and pre-development activities within the package platform.

Your Profile

You are best equipped for this task if you have:

• Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics)
• Semiconductor Packaging, Assembly, and Test
• Experience in Wire bond process
• Process and Equipment Engineering knowledge
• Failure Analysis and Reliability Engineering
• Analytical and Problem-Solving Skills
• AutoCAD and 3D drafting preferred

#WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant's experience and skills. We look forward to receiving your resume, even if you do not entirely meet all the requirements of the job posting. Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process. Diversity & Inclusion at Infineon is described in more detail; please seek out the information from the appropriate channels for more information.