Our innovative start-up, developing ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications, is seeking an Advanced Packaging Engineer to lead device packaging projects and roadmaps.
The role involves developing 2.5/3D advanced packaging solutions and collaborating with OSATs throughout the cycle of concept exploration, design, DFM, engineering runs, development, and quality/reliability. Managing the internal packaging team and driving overall package development within the company are key responsibilities.
This position can be worked remotely.
Please contact Rachel Anderson for further details.
* The salary benchmark is based on the target salaries of market leaders in their relevant sectors. It is intended to serve as a guide to help Premium Members assess open positions and to help in salary negotiations. The salary benchmark is not provided directly by the company, which could be significantly higher or lower.