Senior Principal Optical IC Architect – Broadband

A; Lombardia; Presencial; EUR 140.000 - 190.000; Jornada completa

Descripción de la vacante

ams Italy S.r.l. in Pavia is seeking a Senior Principal Engineer - Broadband IC Architect to define architectures for broadband optical communication ICs and lead technology roadmaps.

You will develop system and IC architectures, translate requirements into specifications, and guide teams through architecture trade-offs, validation, and customer discussions. Candidates should have MSc/PhD in Electrical Engineering and 15+ years of semiconductor IC experience, with multiple tape-outs in advanced

Formación

• MSc or PhD in Electrical Engineering or related field.
• 15+ years semiconductor IC development experience.
• Multiple successful broadband optical IC tape-outs in advanced CMOS nodes.
• Broadband optical IC and PHY architectures with high-speed optical links.
• Advanced CMOS node experience including FinFET and/or FD-SOI.
• MATLAB, Python and/or system modeling tools.

Responsabilidades

• Define broadband optical IC architectures and technology roadmaps.
• Lead architecture trade-off analysis.
• Develop system and IC architectures and translate requirements into subsystem specs.
• Support implementation teams through development and validation.
• Participate in customer and technology roadmap discussions.
• Guide engineering teams on architectural decisions.

Conocimientos

Broadband IC architectures

System modeling

Architecture trade-off analysis

Technical leadership

CMOS design experience

Educación

MSc/PhD EE

Herramientas

MATLAB

Python

Descripción del empleo

ams Italy S.r.l. in Pavia is seeking a Senior Principal Engineer - Broadband IC Architect to define architectures for broadband optical communication ICs and lead technology roadmaps.

You will develop system and IC architectures, translate requirements into specifications, and guide teams through architecture trade-offs, validation, and customer discussions. Candidates should have MSc/PhD in Electrical Engineering and 15+ years of semiconductor IC experience, with multiple tape-outs in advanced