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NXP Semiconductors NV in Italy seeks a Senior Layout Engineer to drive the physical implementation of complex analog/mixed-signal IC designs from floorplanning to tape-out. You will collaborate with design, verification, and technology teams, delivering milestones and mentoring junior engineers.
The role requires deep expertise in layout methodologies, problem-solving, and strong English communication. Expect to work on advanced nodes with tight schedules and a competitive benefits package.
The Senior Layout Engineer is a highly skilled technical contributor responsible for the physical implementation of complex analog, mixed-signal, and custom IC designs. Working with a high degree of independence, this role drives layout execution from floorplanning through tape-out, ensuring that performance, quality, reliability, and schedule objectives are achieved.
The position requires strong expertise in advanced layout methodologies, excellent problem-solving capabilities, and effective collaboration with design, verification, and technology teams. In addition to delivering critical project milestones, the engineer provides technical guidance to less experienced engineers, contributes to methodology improvements, and plays a key role in mitigating project risks and supporting successful silicon delivery.
NXP is committed to equal pay for equal work and work of equal value and applies fair, consistent and transparent remuneration practices.
As of the date of this posting, the estimated gross annual base salary range for this position in Italy is between 50,600 € and 69,600 € annually. This range is intended as a guideline. Actual compensation may vary based on qualifications, experience, skills, and specific business or organizational needs. This position falls under the applicable National Collective Labour Agreement (Metalmeccanica Industria). Where relevant, the total compensation package may also include additional elements such as annual incentive opportunities and/or equity, along with a competitive benefits package.
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