Lead Power Converter Architect for AI Compute

Renesas Electronics

Catania

In loco

EUR 71.000 - 95.000

Tempo pieno

13 giorni fa
Generatore di candidature

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Descrizione del lavoro

Renesas Electronics is seeking a Senior Staff Application Engineer to help define the next generation of power delivery solutions for AI and high-performance computing. You will explore DC/DC converter architectures, lead PoC development, and translate system requirements into silicon product definitions.

The role spans architecture, simulation, hardware implementation and cross-functional collaboration with Systems Engineering, IC Design, Applications, Packaging, Technology and Marketing teams.

Competenze

  • 10+ years of experience in power conversion and related system design.
  • Experience in design, modeling, development and lab validation of high-performance power converters.
  • Master's degree in Electrical Engineering or closely related discipline.

Mansioni

  • Define and evaluate next-generation power conversion architectures for AI and HPC platforms.
  • Lead technology pathfinding, topology studies and PoC development for high-performance DC/DC converters.
  • Develop detailed electrical and system-level models using SIMPLIS and other tools.
  • Translate system-level and customer requirements into device-level specifications for silicon product definition.
  • Plan and execute converter characterization with data collection, analysis and correlation to simulations.

Conoscenze

Power electronics
System design
Electrical engineering

Formazione

Master's degree in Electrical Engineering

Strumenti

SIMPLIS
Python

Descrizione del lavoro

Renesas Electronics is seeking a Senior Staff Application Engineer to help define the next generation of power delivery solutions for AI and high-performance computing. You will explore DC/DC converter architectures, lead PoC development, and translate system requirements into silicon product definitions.

The role spans architecture, simulation, hardware implementation and cross-functional collaboration with Systems Engineering, IC Design, Applications, Packaging, Technology and Marketing teams.

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