Computational Electromagnetics Engineer

microTECH Global Limited; Milano; In loco; EUR 60.000 - 75.000; Tempo pieno

Descrizione del lavoro

microTECH Global Limited is seeking a highly skilled engineer to develop electromagnetic models and numerical algorithms for next-generation hardware and communication systems.

You will build automated workflows for high-speed interconnect analysis across PCBs, packages and channels, combining physics-based and reduced-order models. Collaborate with SI and hardware teams to translate complex results into practical design guidance.

Competenze

• Strong understanding of computational electromagnetics, numerical methods or scientific computing.
• Hands-on experience with electromagnetic simulation tools such as HFSS, CST Studio Suite, COMSOL Multiphysics, Keysight ADS.
• Experience developing numerical algorithms, engineering software or automated simulation workflows using Python, C++, MATLAB or a similar language.
• Ability to evaluate simulation results for numerical accuracy and convergence.
• Candidates from related disciplines with high-speed signal integrity experience are useful but not essential.
• Interest in developing reliable, reusable engineering solutions.

Mansioni

• Develop electromagnetic models, numerical algorithms and reusable tools for analyzing high-speed interconnect systems.
• Build robust methodologies and automated workflows across products and hardware generations.
• Translate complex computational results into practical design guidance.
• Validate results, assess numerical accuracy and distinguish artefacts from physical behaviour.
• Collaborate with signal integrity and hardware engineers on the team's technical roadmap.

Conoscenze

Computational electromagnetics

Numerical methods

Scientific computing

Software engineering

Python

C++

MATLAB

Formazione

Advanced degree in a relevant field

Strumenti

HFSS

CST Studio Suite

COMSOL Multiphysics

Keysight ADS

Python

MATLAB

C++

Descrizione del lavoro

Location: Milan, Italy
Salary: €60,000 to €75,000, plus discretionary bonus

We are recruiting for a global technology company developing advanced computational methods for next-generation hardware and communication systems.

This role combines computational electromagnetics, numerical methods and software engineering. You will develop electromagnetic models, numerical algorithms and reusable engineering tools for analysing and optimising high-speed interconnect systems.

Rather than carrying out one-off simulations, you will build robust methodologies and automated workflows that can be used across multiple products and hardware generations. Your work will cover PCBs, semiconductor packages, connectors, cables and complete communication channels.

You will develop physics-based and reduced-order models, optimisation workflows and simulation automation tools. You will also validate results, assess numerical accuracy and convergence, and distinguish genuine physical behaviour from numerical artefacts.

Working closely with signal integrity and hardware engineers, you will translate complex computational results into practical design guidance and contribute to the team’s longer-term technical roadmap.

Your background

You will have a strong understanding of computational electromagnetics, numerical methods or scientific computing, developed through an advanced degree or relevant industrial or research experience.

You should have hands‑on experience with electromagnetic simulation tools such as HFSS, CST Studio Suite, COMSOL Multiphysics, Keysight ADS or an equivalent framework. Experience developing numerical algorithms, engineering software or automated simulation workflows using Python, C++, MATLAB or a similar language is also important.

You should be comfortable evaluating the quality of simulation results, including numerical accuracy, convergence and model validation, rather than simply operating existing simulation tools.

Candidates may come from computational electromagnetics, RF, antennas, microwave engineering, integrated photonics, computational physics, electronic packaging, applied mathematics or related disciplines. Previous high-speed signal integrity experience would be useful, but it is not essential.

Additional experience

Experience with transmission line theory, interconnect modelling, channel analysis, impedance discontinuities, eye diagrams, BER, TDR or TDT, crosstalk and channel compliance would strengthen your application.

Knowledge of PCIe, Ethernet, DDR, USB or SerDes would also be valuable, as would experience in advanced packaging, chip-package co-design or heterogeneous integration.

The team is also interested in candidates with experience in model order reduction, surrogate modelling, numerical optimisation, uncertainty quantification, Monte Carlo analysis, Design of Experiments or machine learning for computational physics.

You are not expected to cover every area. The priority is strong electromagnetic and computational knowledge, combined with an interest in developing reliable and reusable engineering solutions.