MGR II R&D/PRODUCT DVL ENGINEERING

TE Connectivity; Bengaluru; On-site; INR 1,800,000 - 2,500,000; Full time

Job summary

TE Connectivity in Bengaluru is looking for a Principal Signal Integrity Engineer to lead electrical architecture and signal integrity solutions for high-speed interconnects. You will drive methodologies and define standards within a collaborative cross-functional team.

Your role focuses on advanced simulation, guiding PCB design, and mentoring engineers to enhance the design processes. Candidates should have over 12 years of relevant experience and a degree in Electrical Engineering. Join us to help create innovative interconnect solutions!

Qualifications

• 12+ years of relevant experience in signal integrity and high-speed design.
• Deep expertise in signal integrity analysis tools.
• Experience in mentoring and training junior engineers.

Responsibilities

• Lead advanced signal integrity simulation and analysis.
• Define signal integrity performance and requirements for new products.
• Review and guide PCB interface design.
• Collaborate with global teams to solve system-level challenges.

Skills

Signal integrity analysis

High-speed design

EM simulation techniques

Mentoring engineers

PCB design

Education

Bachelor’s or Master’s degree in Electrical Engineering

Tools

Agilent ADS

Ansys HFSS

CST

Job description

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world.

Job Overview

As a Principal Signal Integrity Engineer, you will lead the electrical architecture, system‑level design strategy, and advanced signal integrity solutions for high‑speed interconnect platforms, including connectors, cable assemblies, and system interfaces. You will serve as the technical authority driving signal integrity methodologies, defining design standards, and influencing product roadmaps aligned with next‑generation high‑speed protocols. This role requires close collaboration with global cross‑functional teams and direct engagement with key customers to solve complex system‑level challenges. In addition, you will play a critical role in developing organizational capability by mentoring and training engineers, ensuring strong technical depth across the team.

Key Responsibilities

• Lead and perform advanced signal integrity simulation and analysis for high‑speed interconnects, including connectors, cable assemblies, and PCB interfaces using EM and circuit simulation techniques.
• 12+ years of relevant experience in signal integrity and high‑speed design, including interconnect and/or system‑level applications.
• Lead signal integrity design and optimization of connectors and cable assemblies to meet system‑level performance requirements.
• Establish signal integrity performance and functional requirements for new product development.
• Review and guide PCB interface design (footprints, breakout, routing transitions) from a signal integrity perspective.
• Act as the technical authority for SI‑related challenges across multiple connector and cable assembly programs.
• Drive technology roadmap alignment for high‑speed interconnects with evolving industry requirements.
• Lead customer technical discussions focused on interconnect performance, integration, and optimization.
• Influence cross‑functional decisions across mechanical design, materials, manufacturing, and system integration.
• Drive innovation and continuous improvement in interconnect SI design, modeling, and validation approaches.
• Lead and mentor engineers across regions to ensure consistency in methodologies, design quality, and technical execution.
• Deep expertise in signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent), with extensive hands‑on experience in ADS circuit simulation, channel analysis, and optimization methodologies for high‑speed interconnect systems.
• Strong experience with IBIS‑AMI model simulation for SERDES channel performance evaluation, including advanced understanding of parameter tuning, equalization strategies, and BER/eye diagram analysis, with the ability to interpret results and guide system‑level decisions.
• Expert‑level understanding of electromagnetic theory and electrical circuit behavior, with practical experience working with high‑speed active components such as DSPs, re‑timers, and re‑drivers, and their interaction within system‑level signal paths.
• In‑depth knowledge of eye diagram optimization and signal conditioning techniques, including CTLE, DFE, FFE, and emphasis settings, with the ability to analyze link margins and influence design trade‑offs for performance improvement.
• Proven ability to interpret and guide eye diagram and link‑level performance results from an interconnect perspective, including understanding the impact of equalization techniques (e.g., CTLE, DFE, FFE) on channel behavior in collaboration with system/ASIC teams.
• Demonstrated ability to define SI requirements and guide design decisions for new product development.
• Experience in PCB interface design considerations.
• Demonstrated experience in mentoring, training, and guiding junior engineers in signal integrity and high‑speed interconnect design.

Desired Skills

• Bachelor’s or Master’s degree in Electrical Engineering or a related field

What Your Background Should Look Like

Generally requires Bachelors degree in appropriate field with 12 or more years of experience; or Masters degree with 10 or more years of experience; or PhD level with 6 or more years of experience; or local equivalent.

Competencies

SET : Strategy, Execution, Talent (for managers)