SR/Lead -Hardware Design Engineer

Prodigy Technovations; Bengaluru; On-site; INR 3,000,000 - 6,000,000; Full time

Job summary

Prodigy Technovations is seeking an experienced hardware design engineer to own end-to-end board development for high-speed systems in Bengaluru. You will architect, design, simulate, and validate complex PCIe, USB, DDR interfaces, and MIPI as part of a multi-disciplinary team.

You will lead lab validation, collaborate with RTL, firmware, FPGA, and QA groups, and produce precise design specs and BOMs to ensure robust product readiness.

Qualifications

• 6–10 years of progressive board-level design experience in the semiconductor industry.
• Proficient in high-density/high-speed design including FPGAs, SerDes, PCIe Gen4/5, UFS 4.0, 10/100 GigE, C-PHY/D-PHY, USB 3.2.
• Experience interfacing high-speed memories such as DDR4/DDR5, RDIMM, and SODIMM.
• Strong experience in system integration, schematic design, and PCB layout using industry-standard tools.
• Hands-on hardware validation, board bring-up, and troubleshooting with advanced lab equipment.
• SI/PI analysis and high-speed analog simulations using HFSS, SIwave, ADS, HyperLynx.

Responsibilities

• Lead hardware design from architecture to PCB layout for high-speed boards.
• Design schematic and board for PCIe Gen4/5, DDR4/5, USB 3.2, and related interfaces.
• Perform SI/PI and thermal analyses to ensure reliability.
• Lead lab bring-up, debug, and validation with advanced test equipment.
• Collaborate with Firmware, Software, FPGA, and QA to ensure system integration and EMI/EMC compliance.
• Prepare detailed design specs, BOMs, and validation reports.

Skills

High-speed PCB design

Schematic capture

PCB layout

Signal Integrity (SI)

Power Integrity (PI)

Lab instrumentation

Cross-functional collaboration

Documentation

Education

Bachelor's or Master's degree in Electrical/Electronics/Communication Engineering

Tools

SPICE

Altium

Cadence

HFSS

SIwave

ADS

HyperLynx

Oscilloscopes

Job description

Role & responsibilities

• Design Ownership: Lead the complete hardware design process, including architecture definition, circuit design, schematic capture, and PCB layout for high-speed digital and mixed-signal boards.
• High-Speed Design: Perform schematic and board-level design for high-speed protocols such as PCIe Gen4/Gen5, DDR4/DDR5, USB 4.0, and MIPI.
• Simulation & Analysis: Perform Signal Integrity (SI), Power Integrity (PI), and thermal analysis to ensure design reliability.
• Lab Validation: Lead board bring-up, troubleshooting, and debugging using advanced lab equipment (oscilloscopes, spectrum analyzers, logic analyzers).
• Cross-functional Collaboration: Work closely with Firmware, Software, FPGA, and QA teams to ensure successful system integration and EMI/EMC compliance.
• Documentation: Prepare detailed design specifications, Bill of Materials (BOM), and validation reports.

Basic Qualifications

• Bachelors or Masters degree in Electrical/Electronics/Communication Engineering or related field from a reputed institute.
• 6 to 10 years of progressive experience in board-level design within the semiconductor industry.
• Proficiency in high-density/high-speed design including FPGAs, SerDes, PCIe Gen4/Gen5, UFS 4.0, 10/100 GigE, C-PHY/D-PHY, and USB 3.2.
• Experience interfacing high-speed memories such as DDR4/DDR5, RDIMM, and SODIMM modules.
• Strong experience in system integration, schematic design, and PCB layout using industry-standard tools such as SPICE, Altium, or Cadence.
• Hands-on experience in hardware validation, board bring-up, and troubleshooting using advanced laboratory equipment.
• Experience in Signal Integrity (SI) and Power Integrity (PI) analysis, including high-speed analog simulations using tools such as HFSS, SIwave, ADS, and HyperLynx.
• Hands-on experience with 33GHz and 50GHz oscilloscopes and GHz pattern generators for protocol capture, timing, and eye diagram analysis.
• Strong collaboration skills to work with RTL, Software, and Quality teams for system-level debugging and integration.
• Good verbal and written communication skills with the ability to prepare documentation as per organizational standards.

Soft Skills

• Strong leadership, mentoring, and project management capabilities.
• Excellent written and verbal communication skills for technical documentation and presentations.

Additional Requirement

• Immediate joiners or candidates who can join within 30 days are required to apply
• Should be from a Product/semiconductor-based company.