Silicon Package Design Engineer

Intel Corporation; Bengaluru; Hybrid; INR 1,000,000 - 1,500,000; Full time

Job summary

Intel Corporation in Bengaluru is seeking a Silicon Packaging Design Engineer to drive end-to-end substrate design development, including EMIB technologies, with focus on meeting electrical and manufacturability requirements.

You will collaborate with customers and internal teams, perform layout, routing, and verification tasks, and contribute to sustaining Intel's advanced packaging solutions through innovative design and collaboration.

Qualifications

• Bachelor’s degree in Electrical Engineering, Electronics Engineering, Computer Engineering, or a STEM-related field with 1-6 years of hands‑on experience in silicon packaging design or a Master’s degree with no prior professional experience.
• Proficiency in EDA tools such as Cadence or Siemens for package/PCB design.
• Familiarity with Python, Perl, Linux, and/or SKILL.

Responsibilities

• Develop physical layout designs for silicon packages, assembly test chips, and Intel’s EMIB technologies.
• Collaborate with customers and electrical engineers to optimize signal integrity and power delivery.
• Create bump patterns and placements while adhering to design rule requirements.
• Perform signal routing planning and power grid placement to meet electrical and manufacturing standards.
• Conduct various layout verification processes, including routing checks, connectivity validation, DRC, and electromigration analysis.
• Provide feedback on feasibility studies and implement customer enhancement requests.
• Resolve design and methodology challenges related to layout design tools and workflows.
• Document design processes and maintain collateral in product lifecycle management systems.

Skills

Python

Perl

Linux

Electrical theory

Education

Bachelor’s degree in Electrical Engineering, Electronics Engineering, Computer Engineering, or a STEM field

Master’s degree in related field

Tools

Cadence

Siemens

Job description

Job Details:

Job Description:

The Role and Impact:

Join Intel as a Silicon Packaging Design Engineer, where you will be at the forefront of semiconductor innovation, driving the end-to-end development of cutting-edge substrate designs. In this role, you will perform substrate fit and routing studies to optimize performance, cost, and manufacturability while collaborating with customers and internal teams. Your contributions will directly impact the creation of Intel’s advanced silicon packaging solutions, ensuring they meet electrical and manufacturing requirements.

Business group:

At Intel, the Assembly and Test Technology Development (ATTD) Design group plays a crucial role in advancing the company’s semiconductor packaging technologies. This team focuses on optimizing silicon-package-board performance, driving innovations in substrate design, and supporting Intel’s overall mission of delivering world-class computing solutions. By joining this group, you’ll be part of a collaborative environment that empowers innovation and technical excellence.

Key Responsibilities:

• Develop physical layout designs for silicon packages, assembly test chips, and Intel’s EMIB (Embedded Multi-die Interconnect Bridge) technologies.
• Collaborate with customers and electrical engineers to optimize signal integrity and power delivery.
• Create bump patterns and placements while adhering to design rule requirements.
• Perform signal routing planning and power grid placement to meet electrical and manufacturing standards.
• Conduct various layout verification processes, including routing checks, connectivity validation, DRC (Design Rule Check), and electromigration analysis.
• Provide feedback on feasibility studies and implement customer enhancement requests.
• Resolve design and methodology challenges related to layout design tools and workflows.
• Document design processes and maintain collateral in product lifecycle management systems.

Qualifications:

Minimum Qualifications:

• Bachelor’s degree in Electrical Engineering, Electronics Engineering, Computer Engineering, or a STEM-related field with 1-6 years of hands‑on experience in silicon packaging design, demonstrated through academic projects, internships, coursework, or training OR a Master’s degree in a related field with no prior professional experience.
• Proficiency in EDA tools such as Cadence or Siemens for package/PCB design.
• Familiarity with programming languages such as Python, Perl, Linux, and/or SKILL.
• Strong understanding of electrical field theories and electronic fundamentals.

Preferred Qualifications:

• Excellent written and verbal communication skills.
• Attention to detail and a customer-oriented mindset.
• Highly motivated and results-driven with a passion for innovation.

Take the next step in your career by joining our team of innovators who are shaping the future of semiconductor design.

Job Type:

Experienced Hire

Shift:

Shift 1 (India)

Primary Location:

India, Bangalore

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off‑site. Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.