Silicon Packaging Architect

Intel Corporation; Sarjapur; On-site; INR 3,000,000 - 5,500,000; Full time

Job summary

Intel Corporation in Bangalore is seeking a Silicon Packaging Architect to drive package architecture definitions, ensuring reliability and cost targets while aligning with DCG product requirements. You will lead cross-functional trade-offs and guide transitions from design to production.

The role requires hands-on experience with package design, Xpedition, and simulations, with collaboration across silicon, hardware, and manufacturing teams to deliver scalable, high-performance packaging

Qualifications

• Bachelor's degree with 6+ years in package architecture, or higher degrees with fewer years.
• Expertise in package design and Xpedition software.
• Experience with electrical, thermal, and mechanical tradeoffs and simulations.

Responsibilities

• Develop and define package architecture specifications meeting physical, electrical, thermal, and reliability standards.
• Lead technology tradeoff evaluations balancing performance, manufacturability, and cost.
• Collaborate with silicon, hardware, and packaging teams for high-quality designs.
• Oversee end-to-end package development from design to production transitions.
• Troubleshoot packaging design challenges and implement cost-effective solutions.
• Partner with manufacturing to ensure smooth tapeouts to production.

Skills

Package architecture

Electrical engineering

Thermal analysis

Mechanical considerations

Simulation tools

Manufacturing processes

Troubleshooting

Education

Bachelor's in EE/Mech/Materials

Master's in relevant field

PhD in relevant field

Tools

Xpedition

Job description

As a Silicon Packaging Architect, you will play a pivotal role in translationally directly contribute to advancing Intel's silicon packaging capabilities, ensuring reliability, quality, and innovation in every solution. Business group: Join Intel's Data Center Group (DCG), a dynamic organization driving innovation in the design and devg product requirements into advanced package architecture specifications and delivering end-to-end solutions that meet physical, electrical, thermal, and cost requirements. You will lead technology tradeoff decisions, ensuring silicon packages adhere to rigorous standards and collaborate closely with cross-functional teams to drive seamless execution from design to production. Your expertise welopment of cutting-edge technologies that power global data infrastructure. Our team is dedicated to developing scalable solutions for complex workloads, enabling the world's digital transformation and advancing Intel's leadership in high-performance computing.

Key Responsibilities

• Develop and define package architecture specifications based on product requirements, ensuring alignment with physical, electrical, thermal, and reliability standards.
• Lead technology tradeoff evaluations to deliver optimal solutions that balance performance, manufacturability, and cost.
• Collaborate with silicon, hardware, and packaging teams to ensure high-quality package designs and seamless integration into production workflows.
• Oversee the end-to-end package development process, including design, processes, and procedures, while continuously improving packaging quality standards.
• Troubleshoot packaging design challenges, identify root causes, and implement innovative and cost-effective solutions.
• Partner with manufacturing teams to ensure smooth transitions of packaging designs and tapeouts to production environments.

Minimum Qualifications

• Bachelor's degree in a relevant field (e.g., Electrical Engineering, Mechanical Engineering, Materials Science) with 6+ years of hands-on experience in package architecture, design, and development OR a Master's degree in a relevant field with 4+ years of experience OR a PhD in a relevant field with 2+ years of experience.
• Proven expertise in package design and associated design tool SW Xpedition.
• Proven expertise in electrical, thermal, and mechanical considerations and tradeoffs.
• Proficiency in simulation tools for package analysis (e.g., thermal, mechanical, and signal integrity simulations).
• Strong understanding of manufacturing processes and procedures for silicon packaging.
• Demonstrated ability to troubleshoot and resolve packaging design challenges effectively.

Preferred Qualifications

• Experience collaborating with cross-functional teams, including silicon, hardware, and manufacturing groups.
• Strong communication skills to effectively convey tradeoff decisions and technical solutions.
• Familiarity with industry trends and advancements in silicon packaging technologies.
• Ability to thrive in a fast-paced, innovative environment while driving continuous improvement.

Job Type: Experienced Hire Shift: Shift 1 (India) Primary Location: India, Bangalore Additional Locations:

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence.

* Job posting details (such as work model, location or time type) are subject to change.

Additional Information

Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during your hiring process, please report this immediately to your recruiter.