Process Engineering

Tata Electronics; Mayang; On-site; INR 900,000 - 1,500,000; Full time

Job summary

Tata Electronics in India is seeking an SME - Solder Paste Printer & Reflow Soldering to oversee, optimize and continuously improve SMT production processes, ensuring on-time manufacturing with high quality across ISP products.

You will lead yield and reliability initiatives, develop DOE studies, validate thermal profiles, and coordinate with NPI, TD, and quality teams to drive cost reduction and process excellence.

Qualifications

• Bachelor in related Engineering Discipline (Preferred Electronics Engineering)
• 10-12 years’ hands on experience in SMT industry in a similar role
• Experience in high volume manufacturing environment
• Hands on knowledge of SPP machines ( MPM Momentum / ASM Dek / Ekra / GKG / Fuji / Panasonic )
• Hands on experience with SMT reflow ovens with vacuum / without vacuum ( Heller / Ersa Rehm / Vitronics Soltec etc )
• Familiar with thermal profilers ( KIC , Datapaq , ECD etc )
• Deep Understanding of solder paste behaviour & thermal profiling
• Proficiency in root cause analysis & problem solving tools ( 8D , 5 why , DOE )
• Strong knowledge on Stencil designing (Thickness , aperture , step up / down stencils )
• Familiar with Lean manufacturing

Responsibilities

• Oversee SMT Production Processes of Solder Paste Printing, Inspection & Reflow
• Define and maintain process windows, control plans & CTQ across SPP, SPI & Reflow
• Setup, Operate, Programming, Optimizing SPP & Reflow Soldering machines
• Validation of Stencils, Squeegees, Solder Paste types & Printing parameters
• Develop & validate thermal profiles for PCB assemblies
• Stencil Design & Validation
• Conduct DOE & Process validation for new products and materials
• Setup, Monitor & Control critical reflow parameters (Zone temp., Conveyor Speed, Soak time, Peak temp)
• Develop & maintain Process documentation, WIs & SOPs (SPP, SPI & Reflow)
• All new models trail pre-readiness including trial builds & process validation
• Partner with NPI, TDG to ensure DFMEA and PFMEA of SPP, SPI & Reflow
• Ensure proper solder paste reflow per component and PCB design requirements
• Ensure smooth technology transfer from development to production
• Own ramp-up metrics: yield learning curve, cycle time, scrap reduction
• Lead root cause analysis for yield excursions using SPI data, SPC charts, Yield Trends, FMEA, DOE and failure analysis
• Monitor production yield, defect rates, cycle time and implement corrective / preventive actions
• Collaborate with Quality, NPI & Customer to resolve manufacturing & Quality issues
• Monitor Process parameters (temp zones, conveyor speed, soak time)
• Analyze print defects (Insufficient / excess paste, smearing, bridging, skips, misalignment)
• Analyze soldering defects (tombstoning, voids, cold joints, bridging) and implement corrective actions
• Own cost of ownership and productivity improvement initiatives
• Drive Cycle time and line balancing improvements
• Lead process development, validation & continuous improvement (Kaizen, Poka yoke, Lean Manufacturing)
• To ensure Proper line setup, programming, Program version management ( SPP, SPI & Reflow )
• To ensure compliance with ESD, Safety & IPC standards
• Analyze process data, SPC reports to identify trends & improvement opportunities
• Serve as a technical team member for customers on PCBA Soldering process topics
• Will be technical team member for customer reviews, technology discussions and risk mitigation plans
• First Pass Yield, Yield and Reliability Performance, Productivity Improvement, Cost Optimization, Customer satisfaction and audit outcomes

Skills

DOE

Kaizen

Lean Manufacturing

Root Cause Analysis

Education

Bachelor in related Engineering Discipline (Preferred Electronics Engineering)

Tools

MPM Momentum

ASM Dek

Ekra

GKG

Fuji

Panasonic

Job description

Role Overview

SME - Solder Paste Printer & Reflow Soldering is responsible for overseeing, optimizing & continuously improving processes to ensure on-time manufacturing with high quality of all ISP Products.

Role Overview

SME - Solder Paste Printer & Reflow Soldering is responsible for overseeing, optimizing & continuously improving processes to ensure on-time manufacturing with high quality of all ISP Products.

The role is accountable for process yield, reliability, cost saving while building strong cross functional alignment with NPI & TD, equipment, quality and customer teams.

Responsibilities

Technology & Process Setup

• Manage & Optimization of SMT Production Processes of Solder Paste Printing , Inspection & Reflow.
• Define and maintain all process windows, control plans & CTQ across all products of SPP , SPI & Reflow.
• Setup, Operate, Programming, Optimizing SPP & Reflow Soldering machines.
• Setup & Validation of Stencils, Squeegees, Solder Paste types & Printing parameters.
• Develop & validate thermal profiles for new & existing PCB assemblies.
• Stencil Design & Validation.
• Conduct DOE & Process validation for new products and materials.
• Setup , Monitor & Control critical reflow parameters

(Zone temp., Conveyor Speed, Soak time, Peak temp.)

New Model Readiness

• Develop & Maintain Process documentation, WIs & SOPs (SPP, SPI & Reflow)
• All new models trail pre-readiness (EVT/ DVT / PVT) , new model trail activities including trial builds & process validation.
• Partner with NPI, TDG to ensure DFMEA and PFMEA of SPP,SPI & Reflow (related to soldering & thermal constraints )
• Ensure proper solder paste reflow per component and PCB design requirements
• Ensure smooth technology transfer from development to production.
• Own ramp-up metrics: yield learning curve, cycle time, scrap reduction.

Quality Excellence

• Accountable for first pass yield, final yield and field reliability.
• Lead root cause analysis for yield excursions using SPI data , SPC charts , Yield Trends ,FMEA, DOE and failure analysis.
• Monitor production yield , defect rates , cycle time and implement corrective / preventive actions.
• Collaborate with Quality , NPI & Customer to resolve manufacturing & Quality issues such as tombstoning , voiding , bridging , cold joints and solder balls
• Partner with Quality team to address customer returns, audits and escalations.
• Monitor Process parameters ( temp. Zones , conveyor speedsoak time etc )
• Analyze & control print defects ( Insufficient / excess paste , smearing , bridging , skips , misalignment)
• Analyze soldering defects ( tombstoning , voids , cold joints , bridging etc ) and implement corrective actions

Operational Excellence & Cost Optimization

• Own cost of ownership and productivity improvement initiatives.
• Drive Cycle time and line balancing improvements.
• Lead process development , validation & continuous improvement initiatives ( Kaizen , Poka yoke , Lean Manufacturing )
• To ensure Proper line setup , programming , Program version management ( SPP , SPI & Reflow )
• To ensure compliance with ESD , Safety& IPC standards.
• Analyze process data , SPC reports to identify trends & improvement opportunities.

Customer & Stakeholder Engagement

• Serve as a technical team member for customers on PCBA Soldering process topics.
• Will be technical team member for customer reviews, technology discussions and risk mitigation plans.

Key Deliverables & KPI

• First Pass Yield
• Yield and Reliability Performance
• Productivity Improvement
• Cost Optimization
• Customer satisfaction and audit outcomes.

Education Qualifications

• Bachelor in related Engineering Discipline (Preferred Electronics Engineering)
• 10-12 years’ hands on experience in SMT industry in a similar role ( Paste Printing , Inspection & lead free soldering processes )
• Experience in high volume manufacturing environment.
• Hands on knowledge of SPP machines ( MPM Momentum / ASM Dek / Ekra / GKG / Fuji / Panasonic )
• Hands on experience with SMT reflow ovens with vacuum / without vacuum ( Heller / Ersa Rehm / Vitronics Soltec etc )
• Familiar with thermal profilers ( KIC , Datapaq , ECD etc )
• Deep Understanding of solder paste behaviour & thermal profiling
• Proficiency in root cause analysis & problem solving tools ( 8D , 5 why , DOE )
• Strong knowledge on Stencil designing (Thickness , aperture , step up / down stencils )
• Familiar with Lean manufacturing