NPI Engineer

Tata Electronics; Assam; On-site; INR 1,800,000 - 2,800,000; Full time

Job summary

Tata Electronics in India is seeking an NPI Engineer for SMT & Box Assembly to drive end-to-end product introduction from design to mass manufacture. You will develop processes, validate equipment capability, generate documentation, and coordinate with cross‑functional teams to ensure smooth transitions to mass production.

The role focuses on achieving first‑time right launches, optimizing yields, reliability and cost, while adhering to IPC standards and collaborating with TDG, Process,

Qualifications

• Bachelor or master in Engineering (Mechanical/Industrial/Electronics).
• 5–8 years in SMT + Box Assembly NPI in EMS/electronics/manufacturing.
• Expertise in SMT processes, reflow profiling, stencil design, and soldering technologies.
• Ability to interpret Gerber files, schematics, and PCB design documents.
• Knowledge of CAD/CAM tools for SMT programming; DFM/DFT guidelines.
• Working knowledge and hands-on experience on SMT machines: Screen Print, Pick n Place, Reflow & AOI.
• Experience in high-volume manufacturing.
• Strong understanding of IPC standards (IPC-A-610, J-STD-001, IPC-7351).
• Proficiency in root cause analysis & problem solving tools (8D, 5 Why, DOE).

Responsibilities

• Lead NPI activities from design phase to mass production for SMT & Box Assembly processes.
• Evaluate product designs (DFM) and provide inputs/feedback to Design Team / Customers.
• Prepare NPI Project Plans, timelines & deliverables.
• Conduct feasibility studies for new processes & Products.
• Provide complete NPI documentation for customer approval.
• Develop and maintain all process documentation, work instructions & SOPs.
• All new models trail pre-readiness (EVT/ DVT / PVT).
• Create SMT Programs for Pick n Place/Mounter, SPP, SPI, AOI & Reflow oven based on Gerber, CAD data & BOM.
• Define & develop jigs/ fixtures and ergonomic tools for SMT & Box Assembly operations.
• Define optimal SMT parameters (Solder Paste type, Stencil design, Reflow Profile, Component Placement rule etc.).
• Develop & Validate reflow Profiles for lead free processes.
• Drive First Article Inspection and resolution of SMT related defects.
• Develop process for Wave Soldering, Selective Soldering, assembly line setup, testing & packaging.
• Optimize cycle times and improve process efficiency during NPI trails.
• Accountable for first pass yield, final yield and field reliability.
• Lead root cause analysis for yield excursions using FMEA, DOE and failure analysis during NPI Trails.
• Ensure zero critical quality escapes at launch.
• Identify cost down opportunities (Using 4M Man, Method, Machine & Material).
• To ensure Proper line setup & Program version management during NPI.
• To ensure compliance with ESD, Safety & IPC standards.
• Serve as a technical NPI member for customers.
• Will be technical team member for customer reviews, technology discussions and risk mitigation plans.
• Collaborate with IT teams to connect automation with MES platforms.
• Ensure seamless data flow for production monitoring and traceability.

Skills

SMT processes

Reflow profiling

Stencil design

Soldering technologies

Gerber interpretation

CAD/CAM tools

DFM/DFT guidelines

8D/5 Why/ DOE

Education

Bachelor/Master in Engineering

Tools

Screen Print SMT

Pick and Place

Reflow equipment

AOI

Job description

Job Description:

Role Overview:

TheNPI (New Product Introduction) Engineer – SMT & Assemblyis responsible for end‑to‑end introduction of Integrated System Packages / new electronic products into the SMT and Final assembly production lines. This role ensures smooth transition from design to mass manufacturing by developing processes, validating equipment capability, preparing documentation, and coordinating with cross‑functional teams.

The role is accountable for process yield, reliability, cost saving while building strong cross functional alignment with TDG, Process , Equipment, Quality and Customer teams.

Key Responsibilities:

1. NPI Planning & Project Execution

• Lead NPI Activities from design phase to mass production phase for SMT & Box Assembly Processes.
• Evaluate Product designs (DFM) and provide inputs/feedback to Design Team / Customers.
• Prepare NPI Project Plans, timelines & deliverables.
• Conduct feasibility studies for new processes & Products.
• Provide complete NPI documentation for customer approval.

1. New Model Readiness

• Develop and maintain all process documentation, work instructions & SOPs.
• All new models trail pre-readiness (EVT/ DVT / PVT).
• Create SMT Programs for Pick n Place/Mounter, SPP, SPI, AOI & Reflow oven based on Gerber, CAD data & BOM.
• Define & develop jigs/ fixtures and ergonomic tools for SMT & Box Assembly operations.
• Define optimal SMT parameters (Solder Paste type, Stencil design, Reflow Profile, Component Placement rule etc. )
• Develop & Validate reflow Profiles for lead free processes.
• Drive First Article Inspection and resolution of SMT related defects.
• Develop process for Wave Soldering, Selective Soldering, assembly line setup, testing & packaging.
• Optimize cycle times and improve process efficiency during NPI trails

1. Quality Excellence

• Accountable for first pass yield, final yield and field reliability.
• Lead root cause analysis for yield excursions using FMEA, DOE and failure analysis during NPI Trails.
• Ensure zero critical quality escapes at launch.

1. Operational Excellence & Cost Optimization

• Identify cost down opportunities (Using 4M Man, Method, Machine & Material)
• To ensure Proper line setup & Program version management during NPI.
• To ensure compliance with ESD, Safety & IPC standards.

1. Customer & Stakeholder Engagement

• Serve as a technical NPI member for customers.
• Will be technical team member for customer reviews, technology discussions and risk mitigation plans.

1. System Integration

• Collaborate with IT teams to connect automation with MES platforms.
• Ensureseamless data flow for production monitoring and traceability.

Key Deliverables & KPI

• Ontime Product Launch & First time right
• First Pass Yield and Ramp to Volume Timeline
• NPI Success Rate
• Cost to target achievement
• Customer satisfaction and audit outcomes during NPI Phase.

Required Qualifications

• Bachelor / master in related Engineering Discipline (Preferred Mechanical / Industrial / Electronics)
• 5-8 years’ experience inin SMT + Box Assembly NPI within EMS, Electronics Manufacturing, Automotive Electronics, Consumer Electronics, or similar industry.
• Expertisein SMT Processes, Reflow profiling, Stencil design, and Soldering technologies.
• Ability to interpret Gerber files, schematics, and PCB design documents.
• Knowledge ofCAD/CAM tools for SMT programming & Knowledge of DFM/DFT guidelines.
• Working Knowledge & Handson experience on SMT Machines Screen Print , Pick n Place , Reflow & AOI.
• Experience in high volume manufacturing environment.
• Strong understanding of IPC standards (IPC‑A‑610, J‑STD‑001, IPC‑7351).
• Proficiency in root cause analysis & problem solving tools ( 8D , 5 why , DOE )

Requirements: