Process Engineering

Tata Electronics; Assam; On-site; INR 1,800,000 - 3,000,000; Full time

Job summary

Tata Electronics in India is seeking an experienced SME-SolderPaste Printer & Reflow Soldering expert to oversee and optimize SMT production, ensuring high yields and quality. You will work across NPI, TD, QA, and customer teams while improving processes and reducing costs.

You will define process windows, validate tooling, and lead DOE activities for new and existing PCB assemblies, with hands-on setup of SPP and reflow equipment. Experience with thermal profiling is essential.

Qualifications

• Bachelor in Electronics Engineering is preferred.
• 10–12 years hands-on SMT experience in similar roles.
• Experience with high-volume manufacturing environments.
• Hands-on knowledge of SPP machines and SMT reflow ovens.
• Strong knowledge of solder paste behavior and thermal profiling.

Responsibilities

• Oversee SMT production: solder paste printing, inspection, and reflow.
• Define process windows, control plans, and CTQ across SPP, SPI & Reflow.
• Setup, program, and optimize SPP and reflow machines.
• Validate stencils, squeegees, and printing parameters.
• Develop and validate thermal profiles for PCB assemblies.
• Lead DOE and process validation for new products.
• Ensure proper solder paste reflow per design requirements.
• Own ramp-up metrics: yield learning and cycle time improvements.
• Drive cost optimization and first-pass yield improvements.
• Collaborate with NPI, TD, QA, and customers on issues.
• Maintain documentation: WIs, SOPs for SPP, SPI & Reflow.

Skills

Solder Paste Printing

Reflow Soldering

DOE/Process Validation

Stencil Design

Lean Manufacturing

Root Cause Analysis

Education

Bachelor in Electronics Engineering

Tools

MPM Momentum

ASM Dek

Ekra

GKG

Fuji

Panasonic

Heller

Ersa

Rehm

VitronicsSoltec

KIC

Datapaq

Job description

Job Description:

Role Overview:

SME-SolderPaste Printer & ReflowSoldering is responsible for overseeing, optimizing & continuously improving processes to ensure on-time manufacturing with high quality of all ISP Products.

The role is accountable for process yield, reliability, cost saving while building strong cross functional alignment with NPI & TD, equipment, quality and customer teams.

Responsibilities:

Technology & Process Setup

• Manage & OptimizationofSMTProductionProcessesof SolderPastePrinting ,Inspection & Reflow.
• Define andmaintainallprocess windows, control plans&CTQ across all productsofSPP ,SPI & Reflow.
• Setup,Operate,Programming,OptimizingSPP & ReflowSoldering machines.
• Setup & ValidationofStencils,Squeegees,SolderPastetypes&Printingparameters.
• Develop& validatethermal profiles for new & existing PCB assemblies.
• Stencil Design & Validation.
• Conduct DOE & Process validation for new products and materials.
• Setup ,Monitor & Control critical reflow parameters.
• (Zonetemp.,ConveyorSpeed,Soaktime,Peaktemp.)

New Model Readiness

• Develop&MaintainProcessdocumentation,WIs & SOPs(SPP,SPI & Reflow)
• All new modelstrailpre-readiness (EVT/ DVT / PVT),new model trail activities includingtrial builds & process validation.
• Partner withNPI,TDGto ensure DFMEAandPFMEAofSPP,SPI& Reflow(relatedto soldering & thermalconstraints )
• Ensure proper solder paste reflow percomponentand PCB design requirements
• Ensure smooth technology transferfrom development to production.
• Own ramp-up metrics: yield learning curve, cycle time, scrap reduction.

Quality Excellence

• Accountable for first pass yield, finalyieldand field reliability.
• Lead root causeanalysis for yield excursions usingSPIdata ,SPCcharts ,YieldTrends ,FMEA, DOE and failure analysis.
• Monitor productionyield ,defectrates ,cycletimeand implement corrective / preventive actions.
• CollaboratewithQuality ,NPI & Customer to resolve manufacturing & Quality issuessuch astombstoning ,voiding ,bridging ,coldjointsand solder balls
• Partner withQualityteam to address customer returns,auditsand escalations.
• Monitor Process parameters( temp.Zones ,conveyorspeedsoaktimeetc)
• Analyze & control print defects( Insufficient/ excesspaste ,smearing ,bridging ,skips ,misalignment)
• Analyze soldering defects( tombstoning,voids ,coldjoints ,bridgingetc)and implement corrective actions

Operational Excellence & Cost Optimization

• Own cost of ownershipand productivity improvement initiatives.
• Drive Cycle time and linebalancing improvements.
• Lead processdevelopment ,validation & continuous improvement initiatives( Kaizen, Pokayoke ,LeanManufacturing )
• To ensure Proper linesetup ,programming ,Program version management( SPP, SPI &Reflow )
• To ensure compliance withESD ,Safety&IPC standards.
• Analyze processdata ,SPC reports toidentifytrends & improvement opportunities.

Customer & Stakeholder Engagement

• Serve as a technicalteam memberfor customers onPCBASolderingprocess topics.
• Will betechnicalteam member forcustomer reviews, technologydiscussionsand risk mitigation plans.

Key Deliverables & KPI

• First Pass Yield
• Yield and Reliability Performance
• ProductivityImprovement
• Cost Optimization
• Customer satisfactionand audit outcomes.

Education Qualifications

• Bachelor in related Engineering Discipline (PreferredElectronicsEngineering)
• 10-12years’hands onexperience inSMTindustryin a similar role( PastePrinting,Inspection &lead freesolderingprocesses )
• Experience in high volume manufacturing environment.
• Hands on knowledge of SPPmachines(MPMMomentum / ASM Dek / Ekra / GKG /Fuji /Panasonic )
• Hands on experience with SMT reflow ovens with vacuum/without vacuum( Heller/ Ersa Rehm /VitronicsSoltecetc)
• Familiar with thermal profilers( KIC,Datapaq,ECDetc)
• Deep Understandingof solder pastebehaviour& thermal profiling
• Proficiencyin root cause analysis &problem solvingtools( 8D ,5why ,DOE )
• Strong knowledgeon Stencildesigning(Thickness ,aperture ,step up / downstencils )
• Familiar with Lean manufacturing

Requirements: