Process Engineering

Tata Electronics Private Limited

Assam

On-site

INR 900,000 - 1,300,000

Full time

10 days ago
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Job summary

Tata Electronics Private Limited is seeking an experienced Process Engineer to drive molding operations in Transfer Molding and Post-Mold Cure. The role focuses on understanding molding materials, equipment parameters, and process controls to optimize yield, OEE, and scrap rates.

You will lead problem-solving efforts (8D, 5 Whys, DOE, SPC), work with engineering and production teams, and implement robust corrective and preventive actions.

Qualifications

  • Bachelors degree in a relevant engineering field.
  • 3–5 years experience in transfer molding/EOL processes preferred.
  • Hands-on with transfer molding machines, mold tools and metrology systems.
  • Strong analytical and statistical skills (SPC, Minitab, JMP).
  • Familiar with EOL process flow and interdependencies among molding, PMC, laser marking, singulation and final test.
  • Proven experience in process optimization, problem solving and cross-functional collaboration.

Responsibilities

  • Develop and maintain deep understanding of molding materials, equipment parameters, and process controls in Transfer Molding and Post-Mold Cure stations.
  • Monitor, analyze, and improve yield, OEE, UPH, and scrap rate for molding operations.
  • Drive quality issue resolution using 8D, 5 Whys, DOE, SPC.
  • Collaborate with equipment engineering and production teams to align with specs.
  • Lead process troubleshooting and implement corrective/preventive actions to prevent recurrence.
  • Drive cost reduction via material utilization, automation, cycle time reduction, and optimization.
  • Champion process capability improvements with CPK/SPC monitoring and stability.
  • Support audits and assist in audit preparation and closure of findings.

Skills

SPC
Minitab
JMP
Process troubleshooting
Cross-functional collaboration

Education

Mechanical Engineering
Materials Engineering
Electronics Engineering

Tools

Transfer molding machines
Mold tools
Metrology systems

Job description

Responsibilities
  • Develop and maintain deep understanding of molding materials, equipment parameters, and process controls in Transfer Molding and Post-Mold Cure stations.
  • Monitor, analyze, and improve process performance indicators such as yield, OEE, UPH, and scrap rate for molding operations.
  • Drive quality issue resolution through structured problem-solving methodologies (8D, 5 Whys, DOE, SPC).
  • Collaborate with equipment engineering and production teams to ensure alignment with product and customer specifications.
  • Actively lead process troubleshooting and implement robust corrective/preventive actions to avoid recurrence of quality issues.
  • Spearhead cost reduction activities through material utilization improvement, automation, cycle time reduction, and process optimization.
  • Champion process capability improvements, ensure CPK/SPC monitoring, and maintain process stability.
  • Support customer audits and take ownership in audit preparation, response, and closure of findings related to the molding process.
  • Define and update SOPs, BKM (Best Known Methods), PFMEA, Control Plans, and Work Instructions to ensure process documentation integrity and compliance.
  • Drive automation and digital transformation in molding processes—such as auto mold vision inspection, predictive maintenance triggers, and reduction of human dependency.
  • Support NPI (New Product Introduction) builds, including tool qualifications, molding parameter development, and data gathering for engineering evaluations.
  • Provide process knowledge sharing and training to technicians and operators to uplift line performance and minimize process variation.
  • Coordinate with global teams to benchmark molding process technologies and deploy global best practices.
Education
  • Bachelor’s degree in Mechanical, Materials, Electronics Engineering or a related field.
Experience & Skill
  • Minimum of 3 to 5 years of working experience and, preferably in Transfer Molding /EOL processes of Semiconductor packaging.
  • Hands-on experience with transfer molding machines, mold tools, and associated metrology systems.
  • Strong analytical and statistical skills (SPC, Minitab, JMP, etc.).
  • Familiarity with EOL process flow and interdependencies between molding, PMC, laser marking, singulation and final test.
  • Proven experience in process optimization, problem-solving, and cross-functional collaboration.
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