Sr. Process & Production Engineer

OSI Systems; Hyderabad; On-site; INR 450,000 - 650,000; Full time

Job summary

OSI Systems is seeking a Sr. Process & Production Engineer to lead development of semiconductor and optoelectronic assembly processes, including die attach, wire bonding and encapsulation. The role covers technology transfer, prototyping approvals, and cost/production ramp planning.

The candidate should bring extensive hands-on experience in high-volume manufacturing, familiarity with quality tools like FMEA and Minitab, and proficiency in interpreting mechanical drawings and tooling layouts.

Qualifications

• 10+ years hands-on experience in semiconductors / optoelectronics assembly and packaging.
• Experience with die attach, wire bonding and encapsulation processes.
• Knowledge of FMEA and statistical analysis using Minitab is desirable.

Responsibilities

• Develop semiconductor/optoelectronic assembly and packaging processes (LEDs, Hybrid Micro circuits, Chip on boards).
• Lead technology/product transfer from sister sites; support NPI, BOM creation and prototyping approvals.
• Estimate manufacturing costs, plan equipment capacity and ramp up production.

Skills

Six Sigma

Statistical analysis

Minitab

FMEA

Die attach

Wire bonding

Encapsulation

Tools

SolidWorks

AutoCAD

Vision-based measurement systems

Automatic epoxy machines

Job description

Sr. Process & Production Engineer (Semiconductor /Opto Electronic devices assembly)

Job Responsibilities

• Development of semiconductors / Optoelectronics assembly & Packaging like LEDs, Hybrid Micro circuits, Chip on boards, Optoelectronics packages
• Process development of die attach, wire bonding, encapsulation etc., on various substrates using eutectic, solder, conductive / nonconductive epoxies etc. and transition to manufacturing scale;
• To take lead in Technology /Product transfer from sister companies, NPI Engineering, BOM creation and Maintenance, prototyping & FA Approvals
• To workout manufacturing cost estimates, equipment capacity requirements, production ramp up requirements
• Sustaining process engineering support, training Manufacturing personnel on developed process, SPC and yield analysis.
• Investigate Customer Complaints / corrective action requests, Failure and route cause analysis and initiate corrective and preventive action measures working with other functional groups

Requirements

• 10+ years hands on experience in a reputed Semiconductor / Optoelectronics manufacturing plant in assembly and packaging process development of die attach, wire bond and encapsulation.
• Programming skills with automatic epoxy machines, Optical measurement systems desirable
• Working knowledge of FMEA, Six Sigma and statistical analysis using Minitab etc.;
• To interpret mechanical drawings. Experience preferred to generate drawings in Solid works, Autocad drawings, Programming vision-based measurement systems and process equipment