Process Engineering

Tata Electronics Limited; Assam; On-site; INR 700,000 - 1,100,000; Full time

Job summary

Tata Electronics Limited in India is seeking a skilled engineer to develop and optimize molding processes in Transfer Molding and Post-Mold Cure, driving quality improvements and cost reductions. You will work with global teams and support NPI initiatives to ensure product and customer specifications are met.

The role requires hands-on experience with molding equipment, metrology systems, and strong analytical skills to reduce variation and improve productivity.

Qualifications

• Bachelor’s degree in Mechanical, Materials, Electronics Engineering or related field.
• Minimum of 3 to 5 years in Transfer Molding/EOL processes of Semiconductor packaging.
• Hands-on experience with transfer molding machines, mold tools and metrology systems.
• Strong analytical and statistical skills (SPC, Minitab, JMP, etc.).
• Familiarity with EOL process flow and interdependencies between molding, PMC, laser marking, singulation and final test.

Responsibilities

• Develop and maintain deep understanding of molding materials, equipment parameters, and process controls in Transfer Molding and Post-Mold Cure stations.
• Monitor, analyze, and improve process performance indicators such as yield, OEE, UPH, and scrap rate for molding operations.
• Drive quality issue resolution through structured problem-solving methodologies (8D, 5 Whys, DOE, SPC).
• Collaborate with equipment engineering and production teams to ensure alignment with product and customer specifications.
• Actively lead process troubleshooting and implement robust corrective/preventive actions to avoid recurrence of quality issues.
• Spearmhead cost reduction activities through material utilization improvement, automation, cycle time reduction, and process optimization.
• Champion process capability improvements, ensure CPK/SPC monitoring, and maintain process stability.
• Support customer audits and take ownership in audit preparation, response, and closure of findings related to the molding process.
• Define and update SOPs, BKM, PFMEA, Control Plans, and Work Instructions to ensure process documentation integrity and compliance.
• Drive automation and digital transformation in molding processes—such as auto mold vision inspection, predictive maintenance triggers, and reduction of human dependency.
• Support NPI builds, including tool qualifications, molding parameter development, and data gathering for engineering evaluations.
• Provide process knowledge sharing and training to technicians and operators to uplift line performance and minimize process variation.
• Coordinate with global teams to benchmark molding process technologies and deploy global best practices.

Skills

Analytical thinking

Statistical analysis

Problem solving

Cross-functional collaboration

Education

Bachelor's degree in Mechanical, Materials, Electronics Engineering

Tools

Transfer molding machines

Mold tools

Metrology systems

Job description

Department: Assembly Technology Development

Business: TSAT India

RESPONSIBILITIES:

Develop andmaintaindeep understanding ofmoldingmaterials, equipment parameters, and process controls in TransferMoldingand Post-Mold Cure stations.

Monitor,analyze, and improve process performance indicators such as yield, OEE, UPH, and scrap rate formoldingoperations.

Drive quality issue resolution through structured problem-solving methodologies (8D, 5 Whys, DOE, SPC).

Collaborate with equipment engineering and production teams to ensure alignment with product and customer specifications.

Actively lead process troubleshooting and implement robust corrective/preventive actions to avoid recurrence of quality issues.

Spearhead cost reduction activities through materialutilizationimprovement, automation, cycle time reduction, and process optimization.

Champion process capability improvements, ensure CPK/SPC monitoring, andmaintainprocess stability.

Support customer audits and take ownership in audit preparation, response, and closure of findings related to themoldingprocess.

Define and update SOPs, BKM (Best Known Methods), PFMEA, Control Plans, and Work Instructions to ensure process documentation integrity and compliance.

Drive automation and digital transformation inmoldingprocesses—such as automoldvision inspection, predictive maintenance triggers, and reduction of human dependency.

Support NPI (New Product Introduction) builds, including tool qualifications,moldingparameter development, and data gathering for engineering evaluations.

Provide process knowledge sharing and training to technicians and operators to uplift line performance and minimize process variation.

Coordinate with global teams to benchmarkmoldingprocess technologies and deploy global best practices.

Education:

Bachelor’sdegree in Mechanical, Materials, ElectronicsEngineeringor a related field.

Experience& Skill:

Minimumof 3 to5 years of working experienceand, preferably in TransferMolding/EOL processesof Semiconductor packaging.

Hands-on experience with transfermoldingmachines,moldtools, and associated metrology systems.

Strong analytical and statistical skills (SPC, Minitab, JMP, etc.).

Familiarity with EOL process flow and interdependencies betweenmolding, PMC,lasermarking,singulationand final test.

Proven experience in process optimization, problem-solving, and cross-functional collaboration.