NPI Quality Lead

Tata Electronics (TEPL); Assam; Sur place; INR 1 800 000 - 3 600 000; Plein temps

Résumé du poste

Tata Electronics (TEPL) invites an experienced NPI Quality Lead to manage end-to-end quality planning and execution for new product introductions with OSAT partners. You will drive product and process qualification, build robust control plans, and ensure readiness for ramp to mass production with data-driven problem solving.

You will own quality across gates, align design/manufacturing/test stakeholders, and lead cross-functional teams to achieve target DPPM/FPY, ensuring flawless launches and

Qualifications

• Bachelor's degree in Engineering.
• 10+ years in semiconductor manufacturing/assembly/test quality.
• Experience in NPI and supplier/OSAT management.

Responsabilités

• Own NPI quality deliverables from concept to MP: quality plan, control plan, PFMEA/DFMEA inputs, MSA, SPC strategy, sampling plans, and readiness.
• Lead phase-gate reviews (PRQ/POR/ES/CS/MP) and drive issue closure across design, packaging, test and supplier teams.
• Define CTQs/CTPs, PPV/FAI criteria, golden lot strategy, and qualification lots (ES/CS/MP).
• Align acceptance criteria with product requirements (performance, reliability, package integrity, test coverage).
• Own the NPI Quality Pack: Control Plan, PFMEA, MSA studies, SPC control setup, qualification report, FA reports, deviations, 8D records, readiness checklist.

Connaissances

Quality leadership

NPI

Data analysis

Cross-functional leadership

Formation

Bachelor's degree in Engineering

Outils

Minitab

JMP

SQL

Python

Description du poste

Job Summary

The NPI Quality Lead - OSAT is responsible for end-to-end quality planning and execution during new product introduction at external assembly test (OSAT) partners. This role drives product and process qualification, builds robust control plans, ensures readiness for ramp, and achieves target DPPM/FPY through data-driven problem solving. You will be the single-threaded owner for NPI quality at OSAT-leading gates, aligning design/manufacturing/test stakeholders, and ensuring flawless launch to mass production (MP).

Key Responsibilities

NPI Quality Planning Governance

• Own NPI quality deliverables from concept to MP: quality plan, control plan, PFMEA/DFMEA inputs, MSA, SPC strategy, sampling plans, and REMAIL_ADDRESS readiness.
• Lead phase-gate reviews (e.g., PRQ/POR/ES/CS/MP) and drive issue closure across design, packaging, test, and supplier teams.
• Define CTQs/CTPs, PPV/FAI criteria, golden lot strategy, and qualification lots (ES/CS/MP).
• Align acceptance criteria with product requirements (e.g., performance, reliability, package integrity, test coverage).

Supplier (OSAT) Readiness Process Control

• Validate OSAT readiness for assembly test flows (e.g., wafer sort handoff, die attach, wire bond / flip-chip, mold, singulation, final test, burn-in).
• Review and approve OSAT process documentation: traveller/routers, work instructions, control charts, change management procedures, and escape prevention controls.
• Implement robust SPC (control charts, control limits, reaction plans) for critical steps; drive MSA (GRR) for inline and end-of-line measurements.
• Ensure material control (lots, traceability, moisture sensitivity, bake, MSD handling, labeling, pack-out).

Qualification Reliability

• Plan and execute package/product qualification per target standards and customer segment:
  • Automotive: AEC-Q100/Q104 alignment, IATF 16949 processes, PPAP-like evidence pack.
  • Industrial/Consumer: JEDEC JESD47/22/94 as applicable.
• Define qual matrices, sample sizes, and acceptance criteria; assess results (e.g., HTOL, HAST/uHAST, TC, THB, BHAST, AC, drop, warpage/co-planarity, BIB/burn-in).
• Coordinate FA (FIB/SEM/CSAM/X-ray/decap) and drive 8D for any qual test failures with clear containment, corrective and preventive actions.

Test Strategy Yield/Reliability Improvement

• Partner with Test Engineering to ensure test coverage, guard bands, OBA/OLA, correlation, and outlier screening are adequate for NPI risk profile.
• Monitor DPPM, FPY, bin paretos, retest/rework, drift and excursions; lead DOE and root-cause analysis to drive yield up and escapes down.
• Build escape prevention and early-warning systems (e.g., SPC triggers, stop-ship criteria, deviation controls, recipe locks, recipe checksum audits).

Documentation, Compliance Change Management

• Own the NPI Quality Pack: Control Plan, PFMEA, MSA studies, SPC control setup, qualification report, FA reports, deviations, 8D records, and readiness checklist.
• Ensure compliance to QMS (e.g., ISO 9001; Automotive: IATF 16949 core tools-APQP/PPAP, MSA, SPC, FMEA, 8D).
• Assess and approve OSAT PCNs; manage ECN/PDN/PCN impacts to customers and internal stakeholders.

Stakeholder Customer Interface

• Act as the quality voice for NPI with Design, Pkg Eng, Test Eng, Reliability, Supplier Quality, and Operations.
• Support customer audits, qualification evidence packs, and early customer samples/CS trials with rapid feedback loops.
• Provide executive-level updates on NPI quality risk, readiness, and mitigation plans.

Essential Attributes

• Strong command of quality tools: PFMEA/DFMEA, Control Plans, MSA (GRR), SPC (X-bar/R, IMR, Cpk/Ppk), DOE, 8D/5Why, Ishikawa.
• Hands-on experience with reliability/qualification per JEDEC/AEC, and FA workflows (CSAM, X-ray, SEM/FIB, decap, SAM/warpage).
• Data analysis proficiency (e.g., Minitab/JMP; SQL/Python a plus).
• Excellent communication and leadership; capable of influencing OSAT teams and cross-functional stakeholders.
• Experience with layered process audits (LPA), process capability studies for advanced packaging (FC, WLCSP, SiP).

Qualifications

• Bachelor's degree in Engineering (Electrical, Electronics, Materials, Mechanical, Industrial) or related.
• 10+ years in semiconductor manufacturing/assembly/test quality, and in NPI and supplier/OSAT management.