Equipment Engineer

Kaynes Semicon; Sanand; On-site; INR 1,200,000 - 2,400,000; Full time

Job summary

Kaynes Semicon in Gujarat is seeking a Senior Equipment Engineer for OSAT, overseeing assembly equipment lifecycle and automotive compliance. You will own equipment health, lead troubleshooting, and drive continuous improvement across platforms like die attach and wire bond.

The role requires strong analytical skills, cross-functional collaboration, and adherence to IATF 16949, ISO, OSHA/EHS standards in a high-volume environment.

Qualifications

• Bachelor’s degree in engineering or related field.
• Minimum 5 years in OSAT or semiconductor equipment engineering.
• Experience with automotive semiconductor manufacturing is preferred.
• Strong analytical, problem-solving and cross-functional communication skills.

Responsibilities

• Own technical performance and long-term health of equipment platforms.
• Support FAT/SAT, installation, qualification and production release.
• Ensure capability supports stacked-die, SoC, COB and advanced packages.
• Maintain complete equipment documentation and audit evidence.
• Perform deep troubleshooting across mechanical, electrical, pneumatics and software.
• Lead root cause analysis for downtime and defects.
• Implement permanent corrective and preventive actions.
• Act as escalation owner for chronic or high-impact issues.
• Develop PM programs and implement PdM using condition data.

Skills

Advanced troubleshooting

Cross-functional comms

Analytical thinking

Problem solving

Education

Bachelor’s Degree in Engineering

Tools

EFMEA

Root Cause Analysis

Preventive Maintenance

Predictive Maintenance

CoO analysis

Job description

Designation:

Senior Equipment Engineer – OSAT (Assembly & Advanced Packaging)

Department:

Equipment Engineering / Assembly Manufacturing

Reporting To:

• Primary Reporting: Equipment Engineering Manager / Director
• Functional Reporting: Manufacturing / Process Engineering / NPI–NPD / Quality (as applicable)

Role Summary:

• Responsible for the technical ownership, reliability, availability, compliance, and cost effectiveness of semiconductor assembly equipment supporting conventional, automotive, and advanced packaging technologies.
• The role spans the full equipment lifecycle, including tool installation, advanced troubleshooting, preventive and predictive maintenance, steady-state manufacturing sustainment, and continuous improvement.
• The incumbent ensures automotive-grade robustness, optimized Cost of Ownership (CoO), and compliance with IATF 16949, ISO standards, and OSHA / EHS requirements, supporting both NPI and high-volume production.

Equipment & Process Scope (OSAT – Assembly)

OSAT Processes - Die Attach, Wire Bond (Au, Cu, fine-pitch, multi-row), Stacked-Die Attach & Wire Bonding, Chip-on-Board (COB) Assembly, Flip Chip & Hybrid Assembly, Mold / Transfer Mold / Compression Mold, Tin Plating Lines, Singulation, Optical Inspection Systems (2nd Opt, 3rd Opt, FVI), Supporting equipment (curing ovens, loaders/unloaders, material handling)

OSAT, Automotive & Advanced Packages Power Modules, QFN / DFN, BGA / LGA, FC-BGA / FC-CSP, WLCSP, MEMS, Stacked-Die Packages, SoC-based packages (logic-centric, automotive and industrial), COB (Chip-on-Board) modules, SiP (System-in-Package), 2D, 3D, Photonics, Automotive-grade and high-reliability packages, Thin packages and warpage-sensitive designs

Key Responsibilities

Equipment Engineering & Technical Ownership

• Own technical performance, robustness, and long-term health of assigned equipment platforms
• Support equipment Factory Acceptance Test, Site Acceptance Test, installation, qualification, and production release
• Ensure equipment capability supports stacked die, SoC, COB, and advanced package requirements
• Maintain complete equipment documentation, change records, and audit evidence

Troubleshooting & Corrective Maintenance

• Perform deep-level troubleshooting across mechanical, electrical, pneumatic, vacuum, vision, PLC, and software systems
• Lead root cause analysis for downtime, yield loss, and defect generation tied to equipment behavior
• Implement permanent corrective and preventive actions
• Act as technical escalation owner for chronic, complex, or high-impact equipment issues

Preventive & Predictive Maintenance

• Develop, optimize, and sustain Preventive Maintenance (PM) programs for critical tools
• Implement Predictive Maintenance (PdM) using: Condition-based monitoring, Tool health indicators and alarm trends,Performance and degradation data
• Improve MTBF, reduce MTTR, and minimize unplanned downtime
• Ensure PM execution, traceability, and compliance with audit requirements

Equipment Risk Management & EFMEA

• Develop, maintain, and deploy Equipment FMEA (EFMEA) for assembly equipment
• Align EFMEA with PFMEA, Control Plans, and IATF 16949 requirements
• Support internal, customer, and automotive audits

Cost of Ownership (CoO) & Lifecycle Management

• Drive Cost of Ownership optimization, including: Spare parts strategy and critical inventory planning, Consumables and wear-part reduction
• Maintenance labor and downtime cost control
• Manage equipment lifecycle planning, technology upgrades, and obsolescence risk
• Engage vendors on performance improvement and long-term cost reduction

Automotive, Compliance & Cross-Functional Support

• Support NPI and ramp-up for automotive, SoC, stacked-die, and COB products
• Ensure equipment practices comply with: IATF 16949 automotive quality requirements, ISO quality and environmental standards (ISO 9001, ISO 14001, as applicable), OSHA, EHS, and local safety regulations
• Participate in internal audits, customer audits, and certification assessments
• Collaborate with Process Engineering, Quality, Manufacturing, and EHS teams
• Support operator and technician training with strong safety and compliance focus

Equipment Engineering Methodologies & Tools

• Equipment FMEA (EFMEA)
• Root Cause Analysis (5-Why, Fishbone, Fault Tree)
• Preventive & Predictive Maintenance methodologies
• Reliability engineering (MTBF, MTTR, failure trend analysis)
• Cost of Ownership (CoO) analysis
• Change management and risk assessment
• Data-driven analysis using alarms, downtime, and condition trends

Key Performance Indicators (KPIs)

• Equipment availability / uptime (%)
• Mean Time Between Failure (MTBF)
• Mean Time To Repair (MTTR)
• Preventive maintenance compliance (%)
• Equipment-related downtime impact to production
• Cost of Ownership (CoO) improvement
• Safety, audit, and compliance findings (zero-target)

Qualifications

• Bachelor’s Degree in Engineering (Mechanical, Electrical, Electronics, Mechatronics, Automation, or related field)AND
• Minimum 5 years of in-depth equipment engineering experience in OSAT or semiconductor manufacturing, including: Advanced troubleshooting, Preventive and predictive maintenance systems, Equipment FMEA (EFMEA), Cost of Ownership (CoO) management
• Experience supporting stacked-die, SoC, and COB assembly is strongly preferred
• Exposure to automotive semiconductor manufacturing (IATF 16949)
• Strong understanding of ISO quality systems and OSHA / EHS compliance
• Ability to interpret schematics, diagnostics, and complex equipment controls
• Strong analytical, problem-solving, and cross-functional communication skills

Role Level

This role may be designated as Equipment Engineer or Senior Equipment Engineer based on experience depth, advanced package exposure, automotive program involvement, and NPI ownership.