Printed Circuit Board Design Engineer

Suitable AI; Coimbatore; On-site; INR 600,000 - 1,000,000; Full time

Job summary

Suitable AI is seeking an experienced PCB Design Engineer with 4+ years in multilayer PCB design, high-speed and high-power layouts, DDR memory routing, and HDI technology. Proficiency with Cadence Allegro for schematic capture, library development, and manufacturing outputs is essential.

The role involves collaborating with cross-functional teams to deliver reliable, manufacturable PCB designs that meet electrical, mechanical, and manufacturing requirements across the development lifecycle.

Qualifications

• Diploma or Bachelor's degree in Electronics and Communication, Electrical or Instrumentation Engg.
• Minimum 4 years of hands-on PCB design and layout experience.
• Proficiency in Cadence Allegro for layout and routing.
• Experience with HDI, multilayer stack-ups, and DDR routing.

Responsibilities

• Design multilayer PCBs for high-speed and high-power applications.
• Place components and route while meeting SI/PI constraints.
• Design DDR memory interfaces and high-speed routing techniques.
• Develop high-power PCB layouts with thermal considerations.
• Work on HDI designs with blind/buried/microvias.
• Plan stack-ups and routing strategies for multilayer designs.
• Capture schematics and develop component libraries.
• Generate manufacturing outputs and release drawings.
• Coordinate with fabrication/vendors to resolve design issues.
• Maintain design documentation and revision control.

Skills

PCB design

Schematic capture

Component library

High-speed routing

DDR memory design

Education

Diploma / Bachelors in ECE/EEE/EIE

Tools

Cadence Allegro

Job description

Job Title: PCB Design Engineer

Experience: 4+ Years

Qualification: Diploma / Bachelor's Degree in ECE, EEE, or EIE

Technical Tool: Cadence Allegro

Job Summary

We are looking for an experienced PCB Design Engineer with strong expertise in multilayer PCB design, high-speed and high-power PCB layouts, DDR memory routing, and HDI technology. The ideal candidate should have hands-on experience in schematic capture, component library development, PCB placement and routing, and manufacturing output generation using Cadence Allegro.

The candidate will collaborate with cross-functional engineering teams to deliver reliable, manufacturable, and high-quality PCB designs that meet electrical, mechanical, and manufacturing requirements.

Key Responsibilities

• Design and develop multilayer PCBs for high-speed, high-power, and mixed-signal applications.
• Perform component placement and PCB routing while adhering to signal integrity (SI), power integrity (PI), and electrical design constraints.
• Design DDR memory interfaces and implement high-speed routing techniques.
• Develop high-power PCB layouts with appropriate considerations for current capacity, thermal management, and power distribution.
• Work on High-Density Interconnect (HDI) PCB designs, including blind vias, buried vias, and microvias.
• Plan PCB stack-ups and implement appropriate routing strategies for multilayer designs.
• Perform schematic capture, component library development, and PCB layout design.
• Conduct design reviews and resolve layout-related issues in coordination with hardware, mechanical, SI/PI, and manufacturing teams.
• Ensure compliance with Design for Manufacturability (DFM), Design for Assembly (DFA), and applicable PCB design standards.
• Generate and release manufacturing deliverables, including Gerber files, fabrication drawings, assembly drawings, and other supporting documentation.
• Coordinate with PCB fabrication and assembly vendors to address manufacturing-related queries and resolve design issues.
• Maintain design documentation, revision control, and release records throughout the development lifecycle.

Required Qualifications and Technical Skills

• Diploma or Bachelor's degree in Electronics and Communication Engineering (ECE), Electrical and Electronics Engineering (EEE), Electronics and Instrumentation Engineering (EIE), or a related discipline.
• Minimum 4 years of hands-on experience in PCB design and layout engineering.
• Proficiency in Cadence Allegro for PCB layout design and routing.
• Strong experience in the following areas:
• DDR memory PCB layout and high-speed routing.
• High-power PCB design and power distribution.
• HDI PCB design involving blind, buried, and microvias.
• Multilayer PCB stack-up planning and routing techniques.
• Schematic capture and component library development.
• PCB layout design, Gerber generation, and manufacturing release.
• Good understanding of PCB fabrication, assembly processes, and manufacturing constraints.
• Knowledge of DFM, DFA, and PCB layout design best practices.

Preferred Skills

• Understanding of signal integrity (SI) and power integrity (PI) considerations.
• Experience coordinating with PCB fabrication and assembly vendors.
• Ability to interpret mechanical drawings, component placement constraints, and enclosure requirements.
• Familiarity with PCB design documentation, revision management, and engineering change processes.

Soft Skills

• Strong analytical, troubleshooting, and problem-solving abilities.
• Good communication and interpersonal skills.
• Ability to collaborate effectively with cross-functional engineering teams.
• Strong attention to detail and commitment to design quality.
• Ability to manage multiple assignments and meet project deadlines.

Ideal Candidate Profile

The ideal candidate will have hands-on expertise in Cadence Allegro, multilayer PCB layout, DDR routing, high-power PCB design, and HDI technology. The candidate should be comfortable working across the PCB development lifecycle, from schematic capture and layout design to manufacturing documentation and final design release.